ATS-12D-148-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-12D-148-C1-R0-ND

Manufacturer Part#:

ATS-12D-148-C1-R0

Price: $ 3.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X15MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12D-148-C1-R0 datasheetATS-12D-148-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.13866
30 +: $ 3.05361
50 +: $ 2.88401
100 +: $ 2.71435
250 +: $ 2.54470
500 +: $ 2.45987
1000 +: $ 2.20541
Stock 1000Can Ship Immediately
$ 3.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.56°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-12D-148-C1-R0 is a type of thermal-heat sink, a device that helps to dissipate heat from other components like processors, graphics cards, and even power amplifiers. It is an ideal solution for high-performance, high-power electronics applications. The thermal-heat sink is designed to maintain an optimum temperature of the component by efficiently transferring heat away from the component and out into the environment.

The thermal-heat sink uses a combination of physical and thermal properties to achieve effective cooling. The physical properties of the thermal-heat sink include the size, shape, material, and construction of the heat sink. The size and shape of the heat sink determine the amount of surface area that will be available for heat transfer. The material and construction determine the amount of heat that can be absorbed and dispersed through the heat sink. The thermal properties of the heat sink determine how the heat is transferred away from the component.

The ATS-12D-148-C1-R0 thermal-heat sink utilizes a combination of metal fins and heat pipes to dissipate heat away from the component. The fins are designed to increase the surface area available for heat transfer, allowing for more efficient heat transfer. The heat pipe, which is typically made of copper, is filled with a liquid that acts as a heat conduit. The Heat pipe carries the heat from the component to the fins, where it is dispersed into the environment. This system of fins and heat pipes helps to keep the component at an optimal temperature even under high temperatures.

The ATS-12D-148-C1-R0 thermal-heat sink is designed to be used in a variety of applications, including laptop computers, televisions, and more. It is also designed to fit many components, including CPUs, GPUs, memory chips, and more. The thermal-heat sink is designed to keep components from overheating and provides reliable, efficient heat dissipation.

The ATS-12D-148-C1-R0 is a great choice for applications that require reliable cooling of components with high power requirements. It is a reliable solution for keeping components running at optimum temperatures while dissipating large amounts of heat quickly and efficiently. With the combination of physical and thermal properties, the ATS-12D-148-C1-R0 helps to regulate temperature while enhancing component lifespan and performance.

The specific data is subject to PDF, and the above content is for reference

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