| Allicdata Part #: | ATS20730-ND |
| Manufacturer Part#: |
ATS-12D-156-C2-R0 |
| Price: | $ 4.44 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12D-156-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.03200 |
| 10 +: | $ 3.92112 |
| 25 +: | $ 3.70339 |
| 50 +: | $ 3.48541 |
| 100 +: | $ 3.26762 |
| 250 +: | $ 3.04978 |
| 500 +: | $ 2.83194 |
| 1000 +: | $ 2.77748 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are pieces of metal which allow heat to be dissipated in a large surface area, allowing for a more effective dispersal of the heat in a safe manner. ATS-12D-156-C2-R0 is a type of thermal heat sinks that is specially designed to be used in a variety of applications such as: servers, high-end workstations, home theater systems and more. This type of heat sink not only efficiently dissipates heat, it can also be used in conjunction with fanless cooling systems, such as those found in notebooks or small form factor systems. This allows for greater heat dissipation in tight space constraints.
The ATS-12D-156-C2-R0 is a heat sink that utilizes a combination of thermal undercut and surface mount technology to dissipate heat. The thermal undercut technology used by the heat sink allows for a larger surface area to facilitate heat dissipation from the processor or other heat generating components. This results in a more effective heat dissipation and cooling. The surface mount technology allows for the heat sink to be mounted on components with a much tighter thermal gap than a traditional, non-surface mount heat sink. This increases the thermal efficiency of the heat sink while providing increased reliability in regards to the mounting of the heat sink.
In addition, the ATS-12D-156-C2-R0 thermal heat sink utilizes a unique combination of aluminum and copper fins to spread heat, increasing the thermal efficiency of the heat sink. The aluminum fins efficiently dissipate heat, while the copper fins further increase the heat dissipation by absorbing the heat from the aluminum fins. This makes the heat sink extremely effective in dissipating heat, allowing it to be used in a wide variety of applications.
The ATS-12D-156-C2-R0 thermal heat sink also works in conjunction with fans to further increase the thermal efficiency of the heat sink. This is done by increasing the flow of air through the fins, thus increasing the amount of heat dissipated from the processor or other heat generating components. In addition, the ATS-12D-156-C2-R0 thermal heat sink is designed to be used in conjunction with heat sinks that utilize thermal paste between the heat sink and the component being cooled. This thermal paste further improves the heat dissipation from the component.
Overall, the ATS-12D-156-C2-R0 thermal heat sink is an effective, efficient, and reliable way to dissipate heat from components in various applications. The combination of thermal undercut and surface mount technology, along with the aluminum and copper fins, allows for the heat sink to effectively disperse heat and protect components from thermal damage. The addition of thermal paste further improves the heat dissipation from the component, ensuring that the component is kept at an acceptable temperature.
The specific data is subject to PDF, and the above content is for reference