| Allicdata Part #: | ATS-12D-169-C1-R0-ND |
| Manufacturer Part#: |
ATS-12D-169-C1-R0 |
| Price: | $ 3.27 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12D-169-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.97234 |
| 30 +: | $ 2.89170 |
| 50 +: | $ 2.73105 |
| 100 +: | $ 2.57040 |
| 250 +: | $ 2.40975 |
| 500 +: | $ 2.32942 |
| 1000 +: | $ 2.08845 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.66°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is one of the most important aspects of engineering and design. The efficiency and reliability of a device, component, or system can be heavily impacted by the heat generated within it. Heat sinks are a type of heat-transfer device designed to dissipate heat from a component to an external location, typically a heat-absorbing surface. ATS-12D-169-C1-R0 is a heat sink that has been designed to provide superior thermal performance while remaining cost-effective.
Application Field and Working Principle
Heat sinks are most commonly used in electronics, systems, and components. This includes items such as LEDs, processors, power supplies, and system boards. ATS-12D-169-C1-R0 is a UL-listed product designed to help improve thermal performance in these and other related markets. The product also features increased efficiency and reliability as compared to many other product offerings.
The ATS-12D-169-C1-R0 consists of a two-piece heat sink with a finned cooling element and a custom-designed heat pipe. The finned element is designed to dissipate heat to the surrounding environment and provide a larger surface area for heat absorption. The custom designed heat pipe is designed to direct and transfer heat away from the component and into the environment. The product is capable of dispersing up to 2860 w/mK worth of thermal energy and is rated for up to 75 watts.
In order to ensure maximum efficiency and reliability, the ATS-12D-169-C1-R0 features a number of innovative design elements. These include a cross-finned design which increases the heat dissipation rate, as well as a ridged surface which increases the surface area for heat absorption. This allows heat to be more evenly distributed over the entire surface of the heat sink which ensures maximum surface area contact and increased performance. Additionally, the product features a built-in corrosion resistance coating which prevents oxidation of the copper material and preserves the product over extended periods of time.
The ATS-12D-169-C1-R0 is designed for simple installation and a vast range of compatible support systems. The product includes mounting hardware and is easy to affix directly to the component or system using screws and other fittings. The product is certified for use in a variety of operating environments including commercial, residential, and industrial applications. Additionally, the product is rated for use in temperature ranges from -20 to +85 degrees Celsius which ensures maximum performance in a variety of conditions.
Overall, the ATS-12D-169-C1-R0 provides a reliable, cost-effective solution for managing thermal energy in a variety of electronic, system, and component applications. It features an innovative design which greatly increases efficiency while providing superior corrosion resistance and durability. The product\'s large surface area and high maximum w/mK rating also make it ideal for use in high-performance environments or extreme temperature requirements.
The specific data is subject to PDF, and the above content is for reference