| Allicdata Part #: | ATS20766-ND |
| Manufacturer Part#: |
ATS-12D-189-C2-R0 |
| Price: | $ 4.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12D-189-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.25880 |
| 10 +: | $ 4.14099 |
| 25 +: | $ 3.91079 |
| 50 +: | $ 3.68084 |
| 100 +: | $ 3.45076 |
| 250 +: | $ 3.22071 |
| 500 +: | $ 2.99066 |
| 1000 +: | $ 2.93315 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.74°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Introduction
The ATS-12D-189-C2-R0 thermal solution is a top-tier heat sink designed for applications that require maximum cooling power and efficiency. As a next-generation thermal solution, ATS-12D-189-C2-R0 offers unprecedented reliability and efficiency while maintaining cooling performance on an unprecedented scale. This thermal solution is ideal for applications such as industrial equipment, self-contained devices, and electrical components.
Application Field
The ATS-12D-189-C2-R0 thermal solution is highly effective at effective derating, reducing power consumption by up to 30% in comparison to legacy systems. By utilizing a combination of advanced fin technology and optimized materials, the ATS-12D-189-C2-R0 solution enables intelligent and efficient thermal management. It is ideal for applications such as high-power control systems, motor control, and motor power stages that require maximum performance.
This system can also be used for high-end industrial and laboratory applications that require exceptional heat dissipation. The ATS-12D-189-C2-R0 system can also support system-on-a-chip (SoC) integrated circuit packages, resulting in cost-effective performance with low power consumption and improved reliability. This system is perfect for data centers, server rooms, and general consumer electronics applications, where significant cooling and power efficiency are required.
Working Principle
The ATS-12D-189-C2-R0 thermal solution utilizes an innovative mechanical design to achieve effective cooling performance. This design uses patented sand particles inserted into the system to increase the effective surface area of the fins. As the motorized fan passes over the sand particles, it creates an air cushion to help the heat transfer away from the heat source, resulting in increased thermal performance with improved power efficiency.
In addition to the sand particle insertion, this system utilizes advanced fin cooling technology. This technology utilizes a specialized fin pattern to create air gaps between the fin surface for increased efficiency and performance. The ATS-12D-189-C2-R0 system also features a large and powerful fan array that allows for optimal performance and reliability. This fan array is capable of delivering increased airflow for maximum thermal efficiency.
The ATS-12D-189-C2-R0 thermal solution is a powerful and reliable solution that can provide excellent thermal management performance. This system is capable of efficiently cooling products, chipsets, and components, resulting in optimal performance and energy efficiency. In applications that require high performance and high reliability, the ATS-12D-189-C2-R0 thermal solution is an ideal choice.
The specific data is subject to PDF, and the above content is for reference