| Allicdata Part #: | ATS-12D-19-C1-R0-ND |
| Manufacturer Part#: |
ATS-12D-19-C1-R0 |
| Price: | $ 3.79 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12D-19-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.44673 |
| 30 +: | $ 3.25542 |
| 50 +: | $ 3.06394 |
| 100 +: | $ 2.87242 |
| 250 +: | $ 2.68093 |
| 500 +: | $ 2.48943 |
| 1000 +: | $ 2.44156 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.75°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat Sinks are specialized cooling systems that disperse heat produced from other components, such as CPUs, circuit boards, and GPUs. Heat sinks use conduction and convection to dissipate heat. This process is accomplished by utilizing a wide range of methods, from metallic alloys to advanced fluids. The most common types of heat sinks are active, passive, integrated, and highly-configurable.
ATS-12D-19-C1-R0 Application Field and Working Principle
The ATS-12D-19-C1-R0 heat sink is a highly-configurable aluminum system designed to decrease the thermal load in cases of limited space. This passive cooler is equipped with 12 heat pipes, 19 fins, and an aluminum structure that provide fast and efficient heat dissipation. It is compatible with various types of CPUs, GPUs, and other components that produce heat. The ATS-12D-19-C1-R0 is ideal for instances where the component requires an efficient and highly transferable cooling system and where the system is limited in space.
The ATS-12D-19-C1-R0 functions through convection and conduction. This is accomplished by pulling the heat away from the component and dispersing it into the fins. Heat is transferred into the fins by either convection or conduction. With two methods of conduction, the heat pipes are conduction the warmer air from the components away from the aluminum fins, while the fins themselves take in heat from the environment. This is then dissipated through convection; the fins then disperse the heat by dispersing hot air in the environment, as the fins move up and down, creating a current in the air.
In addition to being used in systems with limited space, this type of heat sink can also be used in applications where the component cannot be accessed for use in fitting an active cooling system, such as in embedded systems and for medical equipment. The ATS-12D-19-C1-R0 is also suitable for applications where a large amount of space is available for cooling but there is a need for an efficient cooling system. It can also provide the benefits of increased efficiency when used in applications where there is a need for large amounts of processing power.
The ATS-12D-19-C1-R0 heat sink has a wide range of applications in the world of modern computing. It is an efficient, effective, and highly-configurable cooling solution ideal for situations where space or access is limited, or where large amounts of processing power is needed. By using a combination of conduction and convection, this heat sinks is able to provide the highest levels of thermal efficiency while simultaneously being an efficient and cost-effective solution.
The specific data is subject to PDF, and the above content is for reference