| Allicdata Part #: | ATS20768-ND |
| Manufacturer Part#: |
ATS-12D-190-C2-R0 |
| Price: | $ 4.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12D-190-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.37220 |
| 10 +: | $ 4.25628 |
| 25 +: | $ 4.02016 |
| 50 +: | $ 3.78365 |
| 100 +: | $ 3.54715 |
| 250 +: | $ 3.31068 |
| 500 +: | $ 3.07420 |
| 1000 +: | $ 3.01508 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.62°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential in the modern electronics world. Heat sinks are some of the most widely used devices for dissipating the excess heat generated by electronics. The ATS-12D-190-C2-R0 Heat Sink is a device designed to provide an efficient and reliable cooling solution for microprocessors, circuits, and other electronics that generate significant amounts of heat during operations.
This device is constructed using an aluminum alloy that not only provides superior thermal conductivity, but is also lightweight and corrosion-resistant. Its compact design allows it to be installed into closed or sealed systems, making it ideal for applications where space is a concern. The device has a fin height of 12.7mm, a fin depth of 190mm, and a fin pitch of 2mm. The aluminum alloy fins are further distributed within the device in a vertical and horizontal offset pattern which increases the overall level of thermal conductivity.
The device is designed to be attached to a heat source such as a CPU, GPU, circuit, or other component that generates elevated temperatures during operations. By attaching the device to the heat source, it increases surface area by allowing the heat to disperse or radiate away from the source. This is due to the natural process of convection which is the movement of thermal energy away from a source. When installed onto the heat source, the device is simply mounted onto the heat source with the use of a heat sink clip, or other fastening methods such as screws or bolts.
The device works by allowing the heat to move away from the heat source, and into the fins of the device. The fins then disperse the heat further into the surrounding environment through the use of conduction and convection. This process increases the cooling capacity and effectiveness of the device as the thermal energy is dissipated from the device. As such, the device can also be used to protect the heat source from developing premature damage due to overheating.
In addition, the device is also designed to be used as a passive cooling solution, meaning that it does not require the use of fan or mechanical systems to aid in the process of cooling. This makes it an economical and low-maintenance cooling solution that is ideal for environments where cooling resources are limited, or in applications where fan-based coolers may be impractical or unviable.
The ATS-12D-190-C2-R0 Heat Sink is a highly versatile and reliable heat sink ideal for cooling microprocessors, circuits, and other components in a variety of electronic systems. Its lightweight construction and efficient fin pattern makes it an economical and reliable solution for a range of thermal management needs.
The specific data is subject to PDF, and the above content is for reference