| Allicdata Part #: | ATS20770-ND |
| Manufacturer Part#: |
ATS-12D-192-C2-R0 |
| Price: | $ 5.03 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12D-192-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.56750 |
| 10 +: | $ 4.44150 |
| 25 +: | $ 4.19479 |
| 50 +: | $ 3.94808 |
| 100 +: | $ 3.70138 |
| 250 +: | $ 3.45462 |
| 500 +: | $ 3.20786 |
| 1000 +: | $ 3.14617 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks: ATS-12D-192-C2-R0 Application Field and Working Principle
Heat sinks are critical components in any electronic device. ATS-12D-192-C2-R0 is a type of heat sink designed to provide maximum cooling performance for today\'s demanding applications. This article will explore the application field and working principle of ATS-12D-192-C2-R0.
The ATS-12D-192-C2-R0 is a high performance compact heat sink that can dissipate as much as 8.7W of power in a confined space. It is manufactured using a high quality Cu-Al10 alloy, and uses precision machining to achieve tight tolerances, minimizing air gaps and ensuring maximum heat dissipation. This reduces component temperatures and improves system reliability and performance. The integrated aluminium heat spreader helps to spread heat more efficiently.
The ATS-12D-192-C2-R0 is ideal for a variety of applications, such as in computers, cooling fans, power supply units, audio amplifiers, LED lighting, household appliances, and industrial equipment. It can be used for a wide range of components, including CPUs, ASICs, GPUs, FPGAs, and Power MOSFETs. The ATS-12D-192-C2-R0 also features optimized fan mounts, which ensure compatibility with a wide variety of PC components.
The working principle of the ATS-12D-192-C2-R0 is to transfer heat away from the component. Heat is generated by the system components and dissipated via the thermal transfer medium into the surrounding air. This is accomplished through a combination of conduction, convection, and radiation. The heat is first conducted away from the source through the thermal transfer medium, such as the aluminium base or the aluminum-copper heat spreader. Then, convection occurs as the air around the heat sink is cooled by the heat transfer medium and drawn away by the fan, thus cooling the system.
Radiation is also used to transfer heat, where the air surrounding the sink is heated up by thermal radiation, and then cooling occurs as the air is cooled by the environment, or by a refrigeration system. This is the most efficient way to transfer heat, as radiation can travel effectively over long distances and does not require a direct contact between source and sink in order to transfer heat. This allows the ATS-12D-192-C2-R0 to efficiently transfer heat even from points far away from the heat sink.
In summary, ATS-12D-192-C2-R0 is a high performance compact heat sink that is suitable for a range of demanding applications. It uses conduction, convection, and radiation in order to transfer heat away from the component, and features an aluminium heat spreader for maximum efficiency. It can be used for a variety of components, and offers optimized fan mounts for universal compatibility. With its high performance cooling capacity, the ATS-12D-192-C2-R0 is an ideal choice for those who require maximum cooling performance in a small space.
The specific data is subject to PDF, and the above content is for reference