| Allicdata Part #: | ATS-12D-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-12D-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12D-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat Sinks have been around since the 1950s, but the idea of using heat conduction to remove heat from computer components is much older. The premise is simple: Heat from the source is dissipated by a material, called a "heat sink," which uses a combination of materials and methods to quickly and effectively absorb the heat and cool the system. Thermal – Heat Sinks are used for cooling and signal conditioning in electronic and electrical applications. The ATS-12D-20-C1-R0 is a Thermal – Heat Sink used in many applications.
The ATS-12D-20-C1-R0 is a single-tower, aluminum radiation heat sink. This heat sink can dissipate up to 20 W of heat from a source, so it is commonly used in high-power applications such as high-power LEDs, transistors, and microcontrollers. The ATS-12D-20-C1-R0 is designed to provide efficient heat transfer from the source to the fins and then out into the surrounding environment. This heat sink also has a set of standard two-pin fan mounting holes for attaching an additional fan for further cooling.
The ATS-12D-20-C1-R0 has a fin pitch of 0.5mm and comes in a variety of sizes and heights. The structure of the heat sink consists of an extruded aluminum section with integrated fins, an anodized finish, and an aluminum base. The base also includes channels in the surface to form additional heat-dissipating surface area by creating turbulences in the air flowing across the surface. The anodized finish also provides a corrosion-resistant finish that helps it to last longer.
The fins of the ATS-12D-20-C1-R0 are designed to increase the surface area for heat-dissipation and to draw heat away from the source. The fins can be arranged in various orientations, allowing for varying cooling effects depending on the application. For example, the fins can be mounted either horizontally or vertically, allowing for maximum heat-dissipation in given conditions. This arrangement also helps to prevent the fins from clogging and to reduce noise during operation.
The ATS-12D-20-C1-R0 is a reliable thermal-heat sink that can be used in many applications. The anodized finish helps to minimize corrosion and reduce noise during operation, while the wide array of mounting options gives a range of possibilities for different applications. In addition, the integrated fan mounting holes on the base of the heat sink allow for additional cooling if necessary. The ATS-12D-20-C1-R0 is a great choice for cooling high-power components, such as LEDs, transistors, and microcontrollers.
The specific data is subject to PDF, and the above content is for reference