| Allicdata Part #: | ATS20784-ND |
| Manufacturer Part#: |
ATS-12D-205-C2-R0 |
| Price: | $ 4.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X6MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12D-205-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.51710 |
| 10 +: | $ 4.39551 |
| 25 +: | $ 4.15120 |
| 50 +: | $ 3.90701 |
| 100 +: | $ 3.66282 |
| 250 +: | $ 3.41863 |
| 500 +: | $ 3.17444 |
| 1000 +: | $ 3.11340 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.00°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a staple of modern electronics, and this has caused numerous businesses and manufacturers to innovate and develop a wide variety of heat sinks for different applications. ATS-12D-205-C2-R0 is a specific type of heat sink that is designed to be used in a variety of applications, and it has specific specifications and features. This article will discuss the ATS-12D-205-C2-R0’s application field, working principle, and more.
General Overview
The ATS-12D-205-C2-R0 is a far-infrared heat sink designed for use in thermal management applications. It is actually part of a complete far-infrared thermal management system that includes multiple components and is designed to be used in air temperatures ranging from -20°C to 90°C. Within this system, the ATS-12D-205-C2-R0 is a core component that helps to manage thermal loads, and its main function is to transfer heat away from heat-generating electronics.
Specifications and Features
The ATS-12D-205-C2-R0 features a durable aluminum shell and is designed to be a reliable, stable heat sink that can withstand variations in temperature and still perform at a high level. It features a height of 12mm, a width of 205mm, a thickness of 2mm, and has a thermal resistance of 0.35°C/W. It also features a filler and a heat pipe that allows it to spread heat quickly and efficiently, resulting in better thermal management. The ATS-12D-205-C2-R0 is also designed to be easy to install and is compatible with a variety of different mounting systems.
Application Field
The ATS-12D-205-C2-R0 heat sink is designed for use in a variety of thermal management applications, including computers, industrial equipment, servers, appliances, cellular phones, televisions, and other electronics that are prone to overheating. It is also designed to be used in applications where space is limited, such as embedded systems and medical devices. Additionally, the ATS-12D-205-C2-R0 heat sink is designed for use in fanless thermal management applications and is designed to provide superior thermal management even in areas where fans are not available.
Working Principle
The ATS-12D-205-C2-R0 heat sink works on the principle of far-infrared radiation. When combined with the embedded heat pipe, the ATS-12D-205-C2-R0 is able to quickly displace heat away from the source and spread it out over a large surface area. The surface area of the heat sink is also treated with a special coating that helps to further increase the rate at which heat is dissipated. This helps to keep temperatures lower, resulting in better thermal management.
Conclusion
The ATS-12D-205-C2-R0 heat sink is a reliable, durable, and effective solution for thermal management applications. It is designed to provide superior thermal management even in fanless applications and can be used in a variety of settings. With its durable construction and superior thermal management capabilities, the ATS-12D-205-C2-R0 heat sink is an ideal choice for any application that requires effective thermal management.
The specific data is subject to PDF, and the above content is for reference