| Allicdata Part #: | ATS-12D-209-C1-R0-ND |
| Manufacturer Part#: |
ATS-12D-209-C1-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12D-209-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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In the field of thermal management, heat sinks are a crucial component to maintain optimal temperature control of any given device. ATS-12D-209-C1-R0 is a specific type of heat sink, and is used to ensure an electronic device\'s temperature does not exceed an optimal level. This particular heat sink is an axial fan model that is designed to be efficient at dissipating heat from a power-converting device.
At its core, this heat sink type performs the task of transferring heat away from the device. It does this by fashioning a pathway for the thermal energy to travel, allowing it to escape the device and be dissipated into the air around it. This pathway is created through the use of fins, which are either cast directly into the base of the heat sink or added separately. The thermal energy is conducted by the fins, which maximizes the heat dissipation capacity of the heat sink.
This allows for increased surface area, which allows the heat sink to disperse more heat. The increased surface area also allows for more air flow around the heat sink, aiding in the dissipating of the thermal energy. The airflow is driven by the axial fan, which is found at the centre of the device. This fan intakes cool air and forces it over the fins of the heat sink as the hot air rises away, dispersing the thermal energy into the air around the heat sink.
Another feature of the ATS-12D-209-C1-R0 is its ability to be tailored to various operating conditions. Factors such as ambient temperature and air pressure can be set to ensure optimal performance within the given conditions. This helps ensure that the device can dissipate the heat as efficiently as possible in order to maintain an optimal temperature. Also, this feature helps minimize the amount of noise created by the fan, as it can be tuned to minimize the sound it creates.
In instances where a direct temperature control is needed, the ATS-12D-209-C1-R0 can also be used. The heat sink is equipped with a sensor that senses both the ambient temperature and the temperature of the thermal energy escaping the device. This is then used to control the speed of the fan, ensuring that regardless of the ambient temperature variations, the temperature of the heat sink remains at a steady level.
The ATS-12D-209-C1-R0 is an ideal heat sink for any device or application that requires thermal management. Its ability to dissipate heat efficiently and its capability to be tuned to various operating conditions make it an exceptional choice. This heat sink is sure to provide an optimal thermal solution to any device or application.
The specific data is subject to PDF, and the above content is for reference