| Allicdata Part #: | ATS-12D-23-C3-R0-ND |
| Manufacturer Part#: |
ATS-12D-23-C3-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12D-23-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat Sinks are a type of thermal equipment designed to transfer the heat generated by electronic components to the atmosphere. The ATS-12D-23-C3-R0 is a high-performance heat sink from Advanced Thermal Solutions, Inc. (ATS). In this article, the ATS-12D-23-C3-R0 will be discussed in detail, including its application field, working principle, features, and more.
Application Field of the ATS-12D-23-C3-R0 Heat Sink
The ATS-12D-23-C3-R0 Heat Sink is designed for a variety of application fields, including telecommunications, computer peripherals, and automotive electronics. It is also suitable for use in medical and industrial device assemblies. Its small form factor and easy-to-install design make it an ideal solution for tight spaces, where large heat sinks are not suitable. The 12D-23-C3-R0 is also designed for commercial applications that require minimal maintenance and cost-effective solutions.
Working Principle of the ATS-12D-23-C3-R0 Heat Sink
Heat sinks are used to dissipate heat generated by electronic components. The ATS-12D-23-C3-R0 is designed to dissipate heat by using aluminum heat pipes along with a set of finned heat spreaders to optimize heat transfer. The finned heat spreaders distribute heat evenly, while the heat pipes transfer the heat away from the device and into the surrounding air. The combination of these methods enables the 12D-23-C3-R0 to maintain a stable core temperature and reduce component temperature.
Key Features and Benefits of the ATS-12D-23-C3-R0 Heat Sink
The ATS-12D-23-C3-R0 Heat Sink is designed to provide superior performance in a small form-factor. The key features and benefits of the ATS-12D-23-C3-R0 are listed below:
- Optimized Design: The 12D-23-C3-R0 is designed to provide superior cooling performance in a small form factor. The finned heat spreaders provide an effective way to distribute the heat evenly throughout the heat sink, while the heat pipes help transfer the heat to the outside atmosphere.
- Easy Installation: The 12D-23-C3-R0 heat sink is designed for quick and easy installation. The heat sink can be mounted using the included mounting bracket, which allows for easy adjustment to fit various applications.
- Cost-effective solution: The 12D-23-C3-R0 heat sink provides a reliable and cost-effective solution for applications that require minimal maintenance. The heat sink’s small form factor allows for a lower cost per thermal unit.
Conclusion
The ATS-12D-23-C3-R0 Heat Sink is an effective and reliable thermal solution for a variety of applications, including telecommunications, computer peripherals, and more. Its optimized design enables superior cooling performance in a small form factor, while the easy installation and cost-effective solution make it an optimal choice for tight spaces and budget-conscious projects. As a result, the ATS-12D-23-C3-R0 heat sink is perfect for a wide range of applications.
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