ATS-12D-57-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-12D-57-C1-R0-ND

Manufacturer Part#:

ATS-12D-57-C1-R0

Price: $ 3.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X20MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12D-57-C1-R0 datasheetATS-12D-57-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.13866
30 +: $ 3.05361
50 +: $ 2.88401
100 +: $ 2.71435
250 +: $ 2.54470
500 +: $ 2.45987
1000 +: $ 2.20541
Stock 1000Can Ship Immediately
$ 3.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 13.13°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-Heat Sinks are widely used in many applications due to their ability to dissipate large amounts of heat. The ATS-12D-57-C1-R0 Heat Sink is one example of a Thermal-Heat Sink with a specific purpose designed to achieve efficient and effective performance. This article will look at the application field and working principle of the ATS-12D-57-C1-R0 Heat Sink.

The ATS-12D-57-C1-R0 Heat Sink is designed for high-performance applications requiring efficient and effective heat dissipation. It has a fin area of 27.87 in2 and is constructed from anodized aluminum. The heat sink\'s fins are configured in a linear array, providing optimal airflow to enable efficient heat dissipation. The ATS-12D-57-C1-R0 Heat Sink is also capable of dissipating up to 20 Watts of heat, providing reasonable performance for a variety of applications.

One application field for the ATS-12D-57-C1-R0 Heat Sink is high-end electronics such as servers, workstations, and gaming computers. As these systems generate a large amount of heat, they require effective cooling solutions in order to operate efficiently and reliably. This heat sink\'s large fin area and optimized airflow pattern provide good thermal performance, making it well-suited for such applications. It is also well-suited for other industrial applications such as motors and power supplies, as the efficient thermal performance of the heat sink will ensure that the components are kept within their safe operating temperatures.

The working principle of the ATS-12D-57-C1-R0 Heat Sink is based on the fact that heat is transferred from the hotter component to the cooler fins of the heat sink, through thermal conduction. This process is initiated when heat is generated by the component and is transferred to the fins through the interface material, which acts as a thermal bridge. The heat is then dissipated into the surrounding air, aided by the fan or blower module attached to the heat sink.

In addition to the above mentioned, the ATS-12D-57-C1-R0 Heat Sink has been designed with several possible user modifiable options such as support for 4-pin PWM fans, an optional fan speed controller, and an adjustable speed fan. All these features make the ATS-12D-57-C1-R0 Heat Sink suitable for a wide range of applications that require an efficient and effective cooling solution.

The ATS-12D-57-C1-R0 Heat Sink is a popular thermal-heat sink solution for applications that require a high level of cooling performance. Its large fin area provides efficient heat dissipation, making it suitable for applications such as high-end electronics, motors, power supplies, and other industrial applications. Its adjustable fan speeds and 4-pin PWM fan support further increase its versatility. All this, combined with its low cost, makes the ATS-12D-57-C1-R0 Heat Sink a great choice for a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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