| Allicdata Part #: | ATS20820-ND |
| Manufacturer Part#: |
ATS-12D-63-C2-R0 |
| Price: | $ 4.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12D-63-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.99420 |
| 10 +: | $ 3.88647 |
| 25 +: | $ 3.67063 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.32°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical component of any electronic product, and heat sinks are a type of component used to keep electronic products from overheating. The ATS-12D-63-C2-R0 heat sink is specifically designed to be used with high-power semiconductor devices that have standard footprint sizes. This heat sink is designed to be attractive and easy to use while providing high levels of thermal performance.
The ATS-12D-63-C2-R0 is a cross-finned heat sink made from an extruded aluminum alloy. This material is designed to dissipate heat quickly and efficiently as the material has a very high thermal conductivity. The heat sink is designed with a single-piece fin structure that is specifically designed for easy installation into a variety of semiconductor devices. The bottom of the heat sink is also designed with several vents to allow proper airflow and further heat dissipation.
This heat sink has a range of applications. It can be used with both power transistors and diodes, as well as microprocessors, memory chips, power MOSFETs, and even Low Drop Out (LDO) regulators. Each of these components has a different power dissipation requirement, and the ATS-12D-63-C2-R0 is designed to meet them. In addition, the heat sink is designed to accommodate a wide range of non-standard footprint sizes.
The working principle of the ATS-12D-63-C2-R0 heat sink is simple and efficient. The heat generated by the semiconductor device as it operates is transferred to the heat sink. The heat sink then dissipates the energy from the semiconductor device through the efficient conduction of the aluminum alloy. The aluminum alloy conducts the heat away from the semiconductor device, providing cooling and protection for the device.
The ATS-12D-63-C2-R0 is a great choice for cooling a variety of semiconductor devices. It is designed to be easy to install and use, while providing high thermal performance. The aluminum alloy provides efficient conduction to quickly and effectively dissipate heat away from the semiconductor device. The design also provides for multiple forms of mounting and compatibility with a wide range of footprints. As such, the ATS-12D-63-C2-R0 is an ideal choice for thermal management in a variety of applications.
The specific data is subject to PDF, and the above content is for reference