| Allicdata Part #: | ATS-12D-87-C1-R0-ND |
| Manufacturer Part#: |
ATS-12D-87-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-12D-87-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-12D-87-C1-R0 Thermal Heat Sink is a complex device designed for the purpose of cooling extreme extremes of temperature, and is promising to revolutionize the design of high performance electronics. The device combines both a thermal conduction and convection process to ensure efficient heat transfer from the targeted area. The result is a device that reduces the amount of heat generated during extreme temperatures while maximizing chip performance.
The ATS-12D-87-C1-R0 Thermal Heat Sink works with a multi-part, synchronized system. The device utilizes a heat pipe first to transfer heat quickly and efficiently from the targeted location. The heat pipe then enters a highly engineered cooling system with fins, fan cavities, and heat spreaders. The coordinated system of various components works together efficiently so that the device can transfer heat away from the components and into the ambient air.
Aside from its sheer cooling capability, the ATS-12D-87-C1-R0 also offers multiple routing options for both input and output pathways. The device has three input channels as well as two manual input and five automatic output channels. This allows the user to customize the number and type of output pathways to their specific application. This feature gives unique cooling capability to high-performance applications, allowing the use of more than one cooling method at a time.
The ATS-12D-87-C1-R0 Thermal Heat Sink is designed with robust materials with a tolerance for high temperature and pressure. The robust design allows users to use the device in harsh environments, with the highest peak temperature ratings as high as 300°C. This makes the device an ideal choice for high performance electronics such as computers, consumer electronics, and large industrial systems.
The ATS-12D-87-C1-R0 Thermal Heat Sink is a versatile device, capable of cooling a wide variety of electronics. It is an ideal choice for device cooling, as it provides efficient heat transfer without the need for large amounts of electrical power. The device can also be easily changed to match the needs of a certain application, making it an attractive choice when looking for an efficient cooling solution.
The specific data is subject to PDF, and the above content is for reference
ATS-12D-87-C1-R0 Datasheet/PDF