ATS-12D-93-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-12D-93-C3-R0-ND

Manufacturer Part#:

ATS-12D-93-C3-R0

Price: $ 4.16
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X20MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12D-93-C3-R0 datasheetATS-12D-93-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.78252
30 +: $ 3.57231
50 +: $ 3.36206
100 +: $ 3.15195
250 +: $ 2.94182
500 +: $ 2.73169
1000 +: $ 2.67917
Stock 1000Can Ship Immediately
$ 4.16
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.42°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management products are an important component of any electrical system, particularly those that require cooling to ensure their proper functioning. The ATS-12D-93-C3-R0, a thermal - heat sink product by UUCooling, is a powerful and reliable component that helps maintain thermal stability even in extreme environments. In this article, we will explore the application fields and working principle of the ATS-12D-93-C3-R0.The ATS-12D-93-C3-R0 is designed to provide passive cooling for a range of electronic components. With its large base and efficient heat dissipation, it ensures maximum thermal stability in extreme temperatures. Its housing is made from a high-grade aluminum alloy which provides superior performance and reliability in any circumstance. Additionally, the unique design of the unit ensures immediate response time, and is a highly efficient way of dissipating heat from any electric component.As for its application field, the ATS-12D-93-C3-R0 is mainly used for cooling processors, graphics cards, memory modules, and other sensitive components that require thermal stability. It is ideal for server systems and data centers, where tight space requirements are necessary. Additionally, it is perfect for microprocessor-controlled devices such as cars, home appliances, and other systems that require thermal regulation. Furthermore, it is compatible with a variety of common CPU sockets, including LGA 1150, 1151, 1155, and more.When it comes to the working principle of the ATS-12D-93-C3-R0, it is an extremely efficient unit that uses thermal conduction to draw heat away from the source. With its large base area, it provides even and efficient heat dissipation across its entire body. The unit is also designed to be incredibly lightweight, allowing it to be easily placed into even the tightest spaces. Additionally, the ATS-12D-93-C3-R0 features two high-efficiency heat sinks, which are responsible for cooling the processor and memory modules.Finally, the ATS-12D-93-C3-R0 also has a number of safety features, ensuring that it works correctly and safely. It is equipped with a built-in fan, allowing it to automatically adjust its thermal management system according to the environment. Additionally, it is also equipped with an overcurrent protection system, making sure that it doesn’t experience any damage due to an excessive power input.Overall, the ATS-12D-93-C3-R0 is an incredibly efficient and reliable thermal – heat sink product. With its advanced cooling technology and unique design, it provides a highly efficient solution for various applications. Furthermore, its safety features make it a great choice for any electrical system that needs reliable cooling. With its wide compatibility and durable construction, the ATS-12D-93-C3-R0 is an excellent choice for any system requiring stable temperatures and reliable performance.

The specific data is subject to PDF, and the above content is for reference

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