| Allicdata Part #: | ATS-12D-94-C3-R0-ND |
| Manufacturer Part#: |
ATS-12D-94-C3-R0 |
| Price: | $ 4.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12D-94-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.92112 |
| 30 +: | $ 3.70335 |
| 50 +: | $ 3.48541 |
| 100 +: | $ 3.26762 |
| 250 +: | $ 3.04978 |
| 500 +: | $ 2.83194 |
| 1000 +: | $ 2.77748 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.49°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat Sinks are usually used to dissipate heat from electrical components that generate heat, helping to prevent heat damage. The ATS-12D-94-C3-R0 is a thermal heat sink commonly used in a variety of applications. In this article, we will look at the application field and working principle of this heat sink.
Application Field
The ATS-12D-94-C3-R0 is designed for applications where thermal management is critical. It is an ideal choice for a variety of high-performance applications, including power conversion, power supplies, motors, and thermal-sensitive components such as processors and memory chips.
The ATS-12D-94-C3-R0 is also an excellent choice for applications that require a lightweight and cost-effective solution. It is designed to be both inexpensive and efficient, making it appealing to many different industries, including telecommunications, automotive, and consumer electronics.
The ATS-12D-94-C3-R0 is also excellent for environments with limited space, as it is compact and lightweight. Additionally, the heat sink is non-conductive, making it safe for use around electricity and other dangerous materials.
Working Principle
The ATS-12D-94-C3-R0 works on a principle known as fins. Fins are thin pieces of metal that are attached to the heat sink in order to promote heat dissipation. As the heat is transferred away from the device, the metal fins absorb it, and the air currents passing through the fins help to dissipate the heat.
The ATS-12D-94-C3-R0 also features a high efficiency thermal solution. The heat sink is designed to provide maximum heat transfer between the component and the air, providing a longer life for the device. Additionally, the heat sink features a low profile design, allowing it to fit into tight spaces and provide ample cooling power.
The ATS-12D-94-C3-R0 is designed to perform in harsh environmental conditions. It is designed for use in applications with temperatures up to 95°C (203°F), as well as humidity ranges of 0-95%. The heat sink is also designed to withstand vibration, making it an ideal choice for applications where shocks and vibrations may be encountered.
Conclusion
In summary, the ATS-12D-94-C3-R0 is a thermal heat sink designed for applications where thermal management is critical. It is an ideal choice for a variety of high-performance applications, including power conversion, power supplies, motors, and thermal-sensitive components such as processors and memory chips. Additionally, the heat sink features a high efficiency thermal solution, a low profile design, and is designed to perform in harsh environmental conditions.
The specific data is subject to PDF, and the above content is for reference