ATS-12E-01-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	22.05°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are essential components that manage the heat generated by most electronic systems. The ATS-12E-01-C3-R0 is a heat sink designed specifically for applications that require high temperatures and moderate to low noise levels. This heat sink is composed of a base plate made of stainless steel and a cooling fin assembly that is soldered and pressed to the base plate. The fin assembly has many fins with unique movement to allow air to flow around the heat sink, allowing for improved heat transfer. The ATS-12E-01-C3-R0 is designed to operate at temperatures from -40°C to +125°C and can handle up to 25 watts of thermal energy.

Application field

The ATS-12E-01-C3-R0 Heat Sink is ideal for applications with high thermal loads in tight spaces. Its small size makes it perfect for applications with limited space, such as laptops, computers, and other electronics. It is also suitable for use in industrial applications, automotive, aerospace, and medical applications. The ATS-12E-01-C3-R0 is an ideal choice for applications requiring durability, low noise levels, and sustained high temperatures. The fin assembly allows this heat sink to dissipate large amounts of heat, while the stainless steel base plate provides strength and durability.

Working principle

The ATS-12E-01-C3-R0 Heat Sink is designed to dissipate heat using the principle of convection. The fins on the heat sink are designed to create an air pocket around them, allowing air to flow around the fins. As air passes over the fins, the fins transfer the heat from the device to the air. This process carries the heat away from the device and dissipates it into the atmosphere. The fins on the ATS-12E-01-C3-R0 are engineered to move air in the most effective way possible, allowing the heat sink to be as efficient as possible.The base plate of the ATS-12E-01-C3-R0 is made from stainless steel and acts as a heatspreader. The stainless steel provides more surface area for the heat to be transferred, and its high thermal conductivity helps to carry the heat away from the device. The baseplate also helps to maximize the contact between the heat sink and the device, making sure that the heat is efficiently dissipated.

Conclusion

The ATS-12E-01-C3-R0 Heat Sink is designed to provide optimal thermal performance for a variety of applications. Its high-quality construction combined with its efficient design makes it ideal for applications with limited space, high temperature requirements, and low noise levels. The fins help to move air effectively, allowing for maximum heat transfer, while the stainless steel baseplate adds strength, durability, and high thermal conductivity. With its small size and reliable performance, the ATS-12E-01-C3-R0 is an ideal choice for thermal management applications.

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