ATS-12E-10-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.87°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-12E-10-C1-R0 application field and working principle Thermal management devices are often used to control temperatures within electrical equipment. Heat sinks are an important part of this equation, as they can help dissipate heat away from sensitive components. The ATS-12E-10-C1-R0 is a thermally managed two-stage heat sink and fan assembly, designed for fan-cooling applications utilizing high speed microprocessors. In this article, we will explore the application field and working principle of the ATS-12E-10-C1-R0.The ATS-12E-10-C1-R0 is a two-stage thermally managed heat sink and fan assembly, designed to dissipate excess heat away from high speed microprocessors. With its all-aluminum construction, the unit acts as a high performance cooling solution, providing efficient cooling properties with minimal noise. The combination of an efficient heat exchanger, high-speed fan and motorized impeller ensures that the heat is dissipated quickly and reliably.The primary application field of the ATS-12E-10-C1-R0 is for fan-cooling applications within computers, servers and other high processing power applications. For optimized cooling performance, the unit should be installed directly onto the processor to ensure maximum heat dissipation. Additionally, mounting can be done onto any PC or server form factors.The ATS-12E-10-C1-R0 functions by taking in warm air from the surrounding environment and then using its high-speed fan and motorized impellers to exhaust the air. The motorized impellers create a negative pressure gradient, which encourages more air to be pulled into the unit. In addition to this, the motorized impellers can be adjusted to ensure that the heat generated by the processors is displaced away from the device.The combination of the high-speed fan and motorized impellers ensure that the ATS-12E-10-C1-R0 has a maximum airflow of 10 CFM. This allows for a large amount of air to be moved across the heat exchanger, ensuring that the warm air is quickly dissipated from the processor area. Additionally, the unit also has thermal protection, which will automatically shut off the fan, should the temperature exceed the pre-set safety threshold.In conclusion, the ATS-12E-10-C1-R0 is a powerful two-stage thermally managed heat sink and fan assembly, designed for fan-cooling applications utilizing high speed microprocessors. With its all-aluminum construction, efficient heat exchanger, high-speed fan and motorized impellers, the unit ensures the heat generated by the processor is quickly and reliably dissipated away from the device. Additionally, the unit also has thermal protection, which will shut off the fan should the temperature exceed the pre-set safety threshold.

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