| Allicdata Part #: | ATS-12E-100-C3-R0-ND |
| Manufacturer Part#: |
ATS-12E-100-C3-R0 |
| Price: | $ 4.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12E-100-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.22163 |
| 30 +: | $ 3.98727 |
| 50 +: | $ 3.75278 |
| 100 +: | $ 3.51823 |
| 250 +: | $ 3.28369 |
| 500 +: | $ 3.04914 |
| 1000 +: | $ 2.99050 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-12E-100-C3-R0 is a part of the Thermal-Heat Sinks range of products. Thermal-Heat Sinks are designed to reduce the temperature of electrical components by dissipating heat away from the operating components. Heat sinks are often mounted on the board of the electronics device to ensure the optimal temperature of the components. The higher the temperature of an electronic device or component, the faster the rate of energy consumption and the greater the risk of electrical malfunction.
The ATS-12E-100-C3-R0 is designed to provide superior cooling performance and universal compatibility. It is a lightweight, low profile passive cooling solution with superior thermal performance. It is designed to be mounted on any type of board. It features an open frame design to allow maximum air flow and to reduce heat buildup, and it is engineered with high quality aluminum which ensures long-lasting durability.
The ATS-12E-100-C3-R0 utilizes a combination of convection and conduction to transfer thermal energy from the components to the surrounding air. The heat sink absorbs the heat which is transferred from the components, and then the air surrounding the heat sink transfers that heat away from the unit. The use of an efficient heat transfer material ensures that the heat is efficiently transferred away from the component and out of the environment. The heat generated by the components is also dissipated by natural convection from the heat sink.
The ATS-12E-100-C3-R0 is a great choice for applications with tight spaces, as it is a low-cost, high performance heat sink solution. In addition, its light weight and low profile design makes it ideal for use in mobile and portable electronic devices. The heat sink is also designed to be completely air tight, which enhances its heat transfer capabilities and prevents dust and other contaminants from entering the enclosed environment. This makes the ATS-12E-100-C3-R0 an ideal solution for applications in the industrial and automotive industries, where environmental protection is a top priority.
In conclusion, the ATS-12E-100-C3-R0 is an excellent choice for applications requiring efficient thermal management and protection from outdoor environments. It is a lightweight, low profile passive cooling solution designed to provide superior cooling performance and universal compatibility. It features an open frame design to allow maximum air flow and reduce heat buildup, and its high quality aluminum construction ensures long-lasting durability. Its airtight design prevents dust and other contaminants from entering the enclosed environment, making it an ideal solution for applications in the industrial and automotive industries.
The specific data is subject to PDF, and the above content is for reference