| Allicdata Part #: | ATS-12E-102-C3-R0-ND |
| Manufacturer Part#: |
ATS-12E-102-C3-R0 |
| Price: | $ 5.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12E-102-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.63806 |
| 30 +: | $ 4.38060 |
| 50 +: | $ 4.12297 |
| 100 +: | $ 3.86524 |
| 250 +: | $ 3.60755 |
| 500 +: | $ 3.34987 |
| 1000 +: | $ 3.28546 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
In the world of thermal management, there are many types of cooling technologies that provide a wide range of services. One such technology is the ATS-12E-102-C3-R0, a specialized heat sink designed for high-power applications. This technology often sees use in a variety of industries such as industrial, consumer, and military sectors.
The ATS-12E-102-C3-R0 is a multi-layered heat sink designed specifically for the transfer and dissipation of heat from high power components. It is comprised of four layers made from aluminum, copper, diamond, and nickel. The diamond layer is used to maximize thermal conductivity, while the nickel layer is used to improve long-term thermal stability. The aluminum layer is designed to promote self-cooling, while the copper layer acts as a thermal barrier.
To operate, an ATS-12E-102-C3-R0 heat sink must be coupled with a secondary, fan-based cooling mechanism. Generally, a 12V DC fan is sufficient to provide the necessary cooling. The fan pulls cool air from the environment, which is then directed through the heat sink. As the air passes through the layers of the sink, it absorbs heat from the components and exits the opposite side. This air-cooling system is quite efficient, allowing the sink to effectively dissipate heat from components even under the most demanding conditions.
The main design advantage of an ATS-12E-102-C3-R0 heat sink is its ability to be customized for specific applications. Its structure allows for the addition of components such as sensors, fans, and temperature switches. These components can be pre-mounted in the heat sink, or installed separately. Furthermore, the sink can be designed to house a wide range of power components, from low-voltage, low-power devices to high-voltage, high-power systems.
While heat sink cooling systems may not be suitable for extremely hostile environments, ATS-12E-102-C3-R0s are designed to endure a wide range of conditions. Its multi-layered structure offers excellent thermal stability, allowing it to maintain a consistent temperature regardless of fluctuations in ambient temperature. In addition, its shell is designed to be resistant to both dust and mechanical shock, enabling it to handle the most extreme of scenarios.
Overall, the ATS-12E-102-C3-R0 is an ideal thermal management solution for a variety of high-power applications. Its multi-layered structure offers thermal conductivity, while its customizable design allows it to be adapted for any application. Coupled with a fan-based cooling system, the ATS-12E-102-C3-R0 can easily handle the most demanding of environments. As such, it is no surprise that the ATS-12E-102-C3-R0 has become a popular choice amongst many industries.
The specific data is subject to PDF, and the above content is for reference