| Allicdata Part #: | ATS20878-ND |
| Manufacturer Part#: |
ATS-12E-110-C2-R1 |
| Price: | $ 5.59 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12E-110-C2-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.07780 |
| 10 +: | $ 4.93920 |
| 25 +: | $ 4.66452 |
| 50 +: | $ 4.39022 |
| 100 +: | $ 4.11585 |
| 250 +: | $ 3.84146 |
| 500 +: | $ 3.56707 |
| 1000 +: | $ 3.49848 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential in virtually every electronic component in order to maintain proper functionality and prolong its lifespan. Heat sinks are a crucial element of thermal management, and the ATS-12E-110-C2-R1 heat sink is one example of a highly efficient and reliable thermal solution.The ATS-12E-110-C2-R1 heat sink is a thermally advanced low profile single-unit solution ideal for applications that require a low profile solution. It is designed with a combination of aluminum and copper construction and also features a 1.5-inch tall profile, which makes it perfect for top-of-the-line applications. This heat sink is perfect for applications that require a compact and efficient thermal solution.The ATS-12E-110-C2-R1 heat sink uses a combination of copper and aluminum to provide maximum efficiency in thermal dissipation. The design of the ATS-12E-110-C2-R1 utilizes an array of finned channels located in the center section of the device that effectively spread the heat away from the device.The ATS-12E-110-C2-R1’s working principle is simple yet efficient. It relies on the basic principles of convection and surface area to achieve effective thermal dissipation. The large finned channels in the center section of the device allow for air circulation which then dissipates heat away from the device. The aluminum base and copper wall of the device also act as heat transfer media that conduct heat away from the device and into the surrounding air.The ATS-12E-110-C2-R1 is ideal for numerous application fields, from desktop and notebook PCs to consumer electronics such as televisions and gaming devices. Its low-profile design makes it a perfect choice for applications where a discreet heat sink is desired. Additionally, the combination of copper and aluminum make it a great choice for applications that need the best thermal performance available.The ATS-12E-110-C2-R1 is designed to stay cool to the touch. Its efficient design helps to ensure that it won\'t overheat, even when placed in high-performance applications. This heat sink is also extremely easy to install with one simple mounting system.In summary, the ATS-12E-110-C2-R1 heat sink is an excellent choice for thermal management in a variety of applications. Its combination of aluminum and copper construction makes it a highly effective choice for dissipating heat away from the device. Its low profile design allows it to fit in tight spaces and its single-unit construction makes it an easy to install solution. This makes the ATS-12E-110-C2-R1 a great choice for a wide range of thermal management applications.
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