ATS-12E-139-C1-R0

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Heat sinks are integral components of powered electronic devices, designed to keep components cool even when exposed to high power or operated for extended periods of time. The ATS-12E-139-C1-R0 is a thermal-heat sink designed to meet stringent requirements of modern electronic applications. This article will discuss the application field and working principle of the ATS-12E-139-C1-R0 thermal-heat sink.

The ATS-12E-139-C1-R0 thermal-heat sink is designed to be used in electronic devices with intensive thermal management needs. This includes applications such as motor, power, or power conversion sub-systems, where it is necessary to dissipate large amounts of heat. It is effective in moderating temperatures in applications such as data processing servers, medical imaging systems, and automotive infotainment systems, as well as industrial and communication platforms. This makes it suitable for applications in a wide range of industries, from mobile and consumer electronics to aerospace.

The ATS-12E-139-C1-R0 thermal-heat sink is built to provide superior temperature control performance. Its construction features a finned heat sink made of a high-performance copper alloy, designed to draw heat away from the component. The copper is anodized to prevent oxidation, and is able to distribute heat evenly across the entire surface of the component. This helps keep the component’s surface temperatures uniform, reducing the risk of damage due to uneven heating or cooling.

The ATS-12E-139-C1-R0 thermal-heat sink is designed to work with a wide range of electronic components. It is compatible with components ranging from small surface-mount transistors to large processor cores. The design of the heat sink also allows for a range of mounting methods, including screw-mounting, rivet-mounting, and direct-mounting. This makes the ATS-12E-139-C1-R0 thermal-heat sink ideal for use in applications where a variety of components need to be cooled effectively.

The ATS-12E-139-C1-R0 thermal-heat sink is further optimized to provide high power density and thermal efficiency. This is achieved by using a special design that combines a high velocity air channel, a finned surface and a heat collection center. This allows for efficient cooling of some of the world’s highest speed and most power-hungry components. As a result, the ATS-12E-139-C1-R0 thermal-heat sink is able to protect components from not only overheating, but also other harmful temperature-related issues such as thermal runaway.

In summary, the ATS-12E-139-C1-R0 thermal-heat sink is a reliable and efficient heat sink that is designed for use in demanding thermal management applications. Its construction features an anodized copper alloy and a special design for maximum cooling effectiveness. It is highly compatible with a wide range of components, and allows for a range of mounting methods. This makes it an ideal choice for a variety of industries, including mobile and consumer electronics, aerospace, and medical imaging. The ATS-12E-139-C1-R0 thermal-heat sink is designed to provide superior temperature control performance and reliable temperature regulation for a range of components.

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