| Allicdata Part #: | ATS20910-ND |
| Manufacturer Part#: |
ATS-12E-14-C2-R0 |
| Price: | $ 4.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12E-14-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.95640 |
| 10 +: | $ 3.85182 |
| 25 +: | $ 3.63787 |
| 50 +: | $ 3.42380 |
| 100 +: | $ 3.20979 |
| 250 +: | $ 2.99580 |
| 500 +: | $ 2.78181 |
| 1000 +: | $ 2.72832 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
ATS-12E-14-C2-R0 is an essential component of any cooling assembly for heat dissipation. Its application fields are wide, and it is an integral part of many fields, such as telecommunications, military, and medical instrumentation.
Heat sinks work by dissipating the heat generated by electronic components away from them. This keeps the components performing up to their standard and potentially prevents critical components from failing due to excessive heat. The ATS-12E-14-C2-R0 is an appropriate heat sink for a range of uses, such as communications, computers, and other consumer electronics.
The thermal properties of the ATS-12E-14-C2-R0 make it a great choice for dissipating the heat generated by electronic components. Its thermal resistance is 25 degrees Celsius/W, allowing it to absorb and dissipate heat quickly and efficiently. The heat sink also has a maximum operating temperature of 100 degrees Celsius, meaning it can be exposed to large amounts of heat without failing.
The ATS-12E-14-C2-R0 is an ideal choice for dissipating modern electronics’ heat. The heat sink’s material of construction ensures that it can quickly and effectively disperse the heat produced by these components. The heat sink is highly efficient, with an optimized finned design, and the low profile of the fins ensures efficient heat dissipation.
The ATS-12E-14-C2-R0 is made of aluminum, which is a highly conductive material. This means that the thermal transfer between the component and the heat sink is very efficient. Aluminum also has a low weight and low profile, making it ideal for a range of applications. The ATS-12E-14-C2-R0’s design allows air to flow freely around it, enabling the efficient dissipation of heat.
The ATS-12E-14-C2-R0 has an optimized fin arrangement that is designed to ensure heat dissipation is maximized. The fins are arranged in a specific pattern to ensure the maximum surface area is exposed to air, allowing maximum cooling. The heat sink also has provisions for mounting, allowing it to be securely and safely mounted onto the components that need to be cooled.
The ATS-12E-14-C2-R0 is an efficient and reliable means of dissipating heat. It is a great choice for applications where the heat generated is large and need to be efficiently dissipated. The material and design of the heat sink ensure that it is highly efficient, dissipating heat quickly and evenly, and the mounting provisions make installation and maintenance easy.
The specific data is subject to PDF, and the above content is for reference