ATS-12E-151-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS20923-ND

Manufacturer Part#:

ATS-12E-151-C2-R0

Price: $ 4.28
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X30MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12E-151-C2-R0 datasheetATS-12E-151-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.88710
10 +: $ 3.78252
25 +: $ 3.57210
50 +: $ 3.36206
100 +: $ 3.15195
250 +: $ 2.94182
500 +: $ 2.73169
1000 +: $ 2.67917
Stock 1000Can Ship Immediately
$ 4.28
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.93°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heatsink technology has been around since the dawn of electrical components, and ATS-12E-151-C2-R0 is one of the latest applications. This article will provide an overview of the application field and working principle of the ATS-12E-151-C2-R0 heat sink.

Application Field

The ATS-12E-151-C2-R0 is designed to provide effective heat transfer for a wide range of applications. These include LED lighting, LEDs, infrared heating, electric drive systems, and high-power modules. The heat sink features a large size and low-profile design, allowing it to be used in more confined spaces with minimal space and installation costs. Thanks to its all-in-one design, the ATS-12E-151-C2-R0 can cover a wide area for efficient airflow and significantly reduce any potential hot spots in the process.

Working Principle

The ATS-12E-151-C2-R0 utilizes a combination of convection and radiation in order to efficiently disperse heat away from electrical components. By utilizing specialized fin structures and fan speeds, the heat sink is able to efficiently transfer heat away from the components. The fins act as a surface area for the heated air to dissipate, and the fan creates a vacuum effect that pulls the warm air away from the components. This heat transfer process is further enhanced by the use of heat pipes, which draw additional heat away from the components and into the fin structures.

The radiative component comes from the use of a highly efficient LED or hot element to emit heat rays. This heat energy is then absorbed by the fins and transferred away from the components, allowing for effective thermal management. Lastly, the convective component of the ATS-12E-151-C2-R0 is achieved through the use of an active fan to create a secondary airflow away from the heat source.

Conclusion

The ATS-12E-151-C2-R0 heat sink provides a comprehensive solution for efficient thermal management. As a highly efficient yet cost-effective solution, the ATS-12E-151-C2-R0 utilizes a combination of convection, radiation, and fan speed to provide highly effective heat transfer. This not only helps to reduce the cost of component cooling, but it also ensures that the components remain in optimal working condition.

The specific data is subject to PDF, and the above content is for reference

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