| Allicdata Part #: | ATS-12E-151-C3-R0-ND |
| Manufacturer Part#: |
ATS-12E-151-C3-R0 |
| Price: | $ 4.02 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12E-151-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.65526 |
| 30 +: | $ 3.45198 |
| 50 +: | $ 3.24904 |
| 100 +: | $ 3.04592 |
| 250 +: | $ 2.84286 |
| 500 +: | $ 2.63980 |
| 1000 +: | $ 2.58903 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATS-12E-151-C3-R0 is a type of thermal - heat sink device which is widely used in various industries and applications. It is designed to efficiently transfer heat from electronics devices, such as CPUs, GPUs, microprocessors, and other components. The ATS-12E-151-C3-R0 features an aluminum extrusion frame with a black oxide finish to ensure maximum performance and functionality. It also features a black anodized aluminum base for added rigidity and improved strength.
The working principle of ATS-12E-151-C3-R0 is fairly simple. The device works by taking in heat from the device it is mounted onto, usually from the CPU or other component, and transferring it away from the device into the air around it. The aluminum extrusion frame acts as a heat sink, allowing heat to be dissipated much faster than if it stayed within the device. The black oxide finish ensures heat transfer is improved without sacrificing durability or reliability. The anodized aluminum base helps to support the aluminum extrusion, as well as providing additional structural rigidity.
The ATS-12E-151-C3-R0 is an incredibly versatile thermal - heat sink device, capable of being used in many different industries and applications. They are commonly used in industrial and commercial applications, ranging from oil rigs and factories to high-end gaming systems and home use. As it is such a flexible device, it is used in a variety of different applications, and in many cases the device will be tailored to meet the specific needs of the user.
One of the main advantages of the ATS-12E-151-C3-R0 is its high thermal efficiency. This device can transfer heat from devices with incredible efficiency and accuracy, helping to keep components running at the correct temperatures. This can help improve the lifespan of the components and even reduce system failure through overheating. It also helps to improve the performance of the device, as the heat is transferred away quicker.
The ATS-12E-151-C3-R0 is available in a variety of different sizes and configurations. This allows the device to be tailored to specific application needs, ensuring that it is able to fit into the given space without any problems. It also helps to reduce the overall cost of the device, as users can purchase the device that best fits their needs.
Overall, the ATS-12E-151-C3-R0 is an incredibly versatile device that is used in many different industries and applications. It is widely used thanks to its efficient heat transfer capabilities and its flexible design. Furthermore, the device is cost effective and can be tailored to meet the user\'s specific needs. This makes the ATS-12E-151-C3-R0 a great choice for those looking for a reliable and efficient thermal - heat sink device.
The specific data is subject to PDF, and the above content is for reference