| Allicdata Part #: | ATS-12E-153-C1-R0-ND |
| Manufacturer Part#: |
ATS-12E-153-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12E-153-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential to ensure reliable operation and performance of sensitive electronic components. Heat sinks are one of the most commonly used methods of dissipating the heat generated by the components. The ATS-12E-153-C1-R0 heat sink is one of the most efficient designs for electronics thermal management.
The ATS-12E-153-C1-R0 heat sink is a thermally conductive aluminum heat sink designed for high power applications. It is designed with extended fins that are effective for heat exchange and heat dissipation across a wide range of temperatures. It is also designed with four recessed horizontal slots near the leading edge that provide additional airflow under the ventilated aluminum fins to increase heat transfer and allow for more effective heat dissipation.
The ATS-12E-153-C1-R0 heat sink is typically used in applications such as power supplies, LED lighting, semiconductors, microprocessors, voltage regulators, telecommunications, and other high power electronics.
The construction of the ATS-12E-153-C1-R0 heat sink consists of tightly spaced aluminum fins, which are soldered to a 1.5 mm thick aluminum platform. This platform is designed to quickly transfer the generated heat from the components to the fins, and then dissipate it to the surrounding environment. The advantage of a soldered-on platform is that it ensures a reliable thermal interface between the component and the heat sink. This ensures a highly efficient heat transfer and dissipation over a wide range of temperatures.
The working principle of theATS-12E-153-C1-R0 heat sink is based on natural convection. When the heatsink is mounted on the component, heat is dissipated through the aluminum fins and dissipated into the surrounding air. The extended aluminum fins significantly increase the exposed area of the heat sink and increase the amount of air that is allowed to circulate across the fins, allowing for more effective dissipation of the heat. The four recessed slots near the leading edge help to increase the airflow beneath the fins, further improving the heat transfer and the dissipation of the heat.
The ATS-12E-153-C1-R0 heat sink is an effective solution for dissipating the heat generated by high power semiconductors, processors, and other electronic components. The efficient design and construction of the heat sink provide reliable thermal management and help ensure the reliable operation and performance of the electronic components in a wide range of applications.
The specific data is subject to PDF, and the above content is for reference