ATS-12E-156-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.24°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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THERMAL - HEAT SINKS

Heat sinks are an important component in many electronics applications, and ATS-12E-156-C3-R0 has made a name for itself as one of the most reliable and cost-effective devices in this class. This heat sink is designed for a range of applications, such as cooling processors, safeguarding electronic circuits, and managing heat buildup in batteries and other high-power devices. Here, we’ll take a closer look at the ATS-12E-156-C3-R0, including its application fields and working principle.

Application Field

The ATS-12E-156-C3-R0 is designed to cool processors and other electronic and semiconductor components by removing heat generated by them. It’s a versatile heat sink that can be used in systems such as data servers, cameras, and other electronic systems. Additionally, it can be used in applications such as power supplies, insulating components, and in medical devices. It’s also suitable for applications with more than one processor, such as desktop computers, workstations, and other equipment.

Working Principle

The ATS-12E-156-C3-R0 uses an advanced aluminum extrusion process to efficiently remove heat from components as heated air is drawn in. The heat sink has a special safe area which allows for safe operation of the components at temperatures below the prescribed limit. This safe area helps keep the components within the prescribed temperature range so that they may perform their best. Additionally, the heat sink uses a slim and low profile design, allowing it to fit into tight spaces. At the core of the ATS-12E-156-C3-R0’s design is a fin array which is designed to dissipate heat quickly and efficiently. The fins are made from aluminum and have a high thermal conductivity, meaning that they can dissipate heat faster than other materials. The fins are arranged in a vertical pattern that creates an optimal airflow that draws in the heated air and moves it away from the components efficiently.

Conclusion

The ATS-12E-156-C3-R0 is an excellent heat sink for a range of applications. It’s designed to efficiently dissipate heat from components, while its slim and low profile design allows for easy installation in tight spaces. Additionally, it’s designed to keep components within a safe temperature range, allowing for optimal performance. With its versatile application fields and reliable working principle, the ATS-12E-156-C3-R0 is an ideal solution for many electronics applications.

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