| Allicdata Part #: | ATS-12E-166-C1-R0-ND |
| Manufacturer Part#: |
ATS-12E-166-C1-R0 |
| Price: | $ 3.08 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12E-166-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.77011 |
| 30 +: | $ 2.69514 |
| 50 +: | $ 2.54533 |
| 100 +: | $ 2.39564 |
| 250 +: | $ 2.24590 |
| 500 +: | $ 2.17103 |
| 1000 +: | $ 1.94643 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.12°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are an important component in all types of electronic and electrical equipment, and are used to dissipate heat away from sensitive components and subsystems. The ATS-12E-166-C1-R0 thermal heat sink is a high-performance thermal solution designed to provide efficient cooling of a wide range of electronic components and applications, including microcontrollers, digital signal processors, and other electronic devices requiring thermal cooling.
The ATS-12E-166-C1-R0 features a hollow fin design made up of 66 pins in a stacked configuration, providing maximum contact with the device’s PCB to improving cooling efficiency. Its height is 14.6mm, and its base size is 12.7 x 12.7mm. It is constructed of a lightweight aluminum alloy that offers superior heat absorption and dissipates heat away from the device quickly. The pins are soldered to the board and rigidly affixed to the circuit board for reliable and secure performance.
The ATS-12E-166-C1-R0’s unique design helps to reduce waste heat by directing it away from the PCB and into the atmosphere, thereby allowing the device to operate at a cooler, more efficient temperature. This, in turn, increases the reliability and lifetime of the device, and helps to minimize power consumption. The heat sink also effectively absorbs noise generated by the device’s power supplies and other components, further improving the device’s overall performance.
The ATS-12E-166-C1-R0 is optimized for a wide range of applications, including computers, medical displays, and industrial controls. Its high-performance aluminum alloy construction is designed to efficiently dissipate up to 70W of heat output, making it an ideal choice for applications requiring efficient cooling. In addition, its small footprint and compact design make it easy to install and service, making it a popular choice for companies looking for a reliable thermal solution for their product.
The ATS-12E-166-C1-R0 is also characterized by its low weight and low profile. Its lightweight aluminum construction is extremely responsive to heat, providing excellent cooling performance. The device’s low profile design helps improve airflow and reduce the effects of air turbulence in the environment. With its innovative design, the ATS-12E-166-C1-R0 is a versatile thermal solution that can be used in a variety of applications, including high-power solutions and high-heat dissipation components.
The ATS-12E-166-C1-R0 thermal heat sink provides an ideal solution for electronic cooling applications. Its lightweight aluminum construction provides superb heat dissipation and its low profile design helps optimize cooling performance. The device’s low weight and size also make it easy to install and service, making it a popular choice for companies looking for a reliable and cost-effective thermal solution for their product. By utilizing the ATS-12E-166-C1-R0, companies can reduce their overall power consumption and increase their product’s reliability and performance.
The specific data is subject to PDF, and the above content is for reference