ATS-12E-187-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-12E-187-C3-R0-ND

Manufacturer Part#:

ATS-12E-187-C3-R0

Price: $ 4.21
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12E-187-C3-R0 datasheetATS-12E-187-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.79386
30 +: $ 3.58323
50 +: $ 3.37239
100 +: $ 3.16159
250 +: $ 2.95082
500 +: $ 2.74005
1000 +: $ 2.68736
Stock 1000Can Ship Immediately
$ 4.21
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.78°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-12E-187-C3-R0 heat sink is a key component of any thermal management system, designed to dissipate heat from electronic equipment. By eliminating thermal hot spots and controlling the internal temperature of the equipment, it is possible to maintain optimal performance of the hardware. This article provides an overview of the application fields and working principle of ATS-12E-187-C3-R0 heat sinks.

Application Fields

ATS-12E-187-C3-R0 heat sinks are designed to keep temperatures inside computer systems and other electronics components at optimal levels. They are most often used in highly-industrialized settings such as datacenters, telecommunications centers, and high-performance computing. These powerful systems generate enormous amounts of heat which can drastically reduce the efficiency of the components inside the system. They are also used in research laboratories and other scientific environments where controlled temperatures are essential.

Furthermore, ATS-12E-187-C3-R0 heat sinks can be used on a variety of components, including CPUs, GPUs, and memory modules. These components generate a considerable amount of heat during operation, and can become damaged if not cooled properly. Therefore, ATS-12E-187-C3-R0 heat sinks are essential for ensuring optimal performance of the hardware.

Working Principle

ATS-12E-187-C3-R0 heat sinks are designed to dissipate heat away from the electronics components. The heat sink consists of a metal surface with fins which are designed to spread the heat over a larger area, allowing it to dissipate more effectively. A fan may also be attached to the heat sink, which helps increase the air circulation and improves the cooling properties of the system further.

The heat from the electronics components is conducted through the metal surface of the heat sink, and then dissipated into the air. Additionally, the fan helps to move air over the heat sink, assisting in the dissipation of heat. This allows the hardware to remain at an optimal temperature and maintain its peak performance.

In order for the ATS-12E-187-C3-R0 heat sink to effectively dissipate heat, it must be properly installed. It is recommended that the fan be attached directly to the heat sink, as this allows for increased air circulation. Additionally, the heat sink should be properly mounted to the component and adequate thermal interface material should be applied. All of these steps must be completed in order to ensure optimal performance of the system.

Conclusion

The ATS-12E-187-C3-R0 heat sink is an essential component of any thermal management system, designed to dissipate heat from the electronics components. It is most often used in highly-industrial settings, such as datacenters and telecommunications centers, where controlling temperatures is essential. The heat sink is designed to dissipate the heat over a larger area, allowing it to dissipate more effectively. Additionally, a fan may be used to improve the cooling properties of the system. In order for the heat sink to operate effectively, it must be properly installed. When installed correctly, the ATS-12E-187-C3-R0 heat sink can help maintain optimal performance of the components inside the system.

The specific data is subject to PDF, and the above content is for reference

Latest Products
VHS-45

HEATSINK HALF BRICK ALUM BLACKHeat Sink ...

VHS-45 Allicdata Electronics
MHST15055

HEATSINK 2.36L X1.4"H EXTRUSIONHeat Sink...

MHST15055 Allicdata Electronics
MHST10055

HEATSINK 2.36L X.94"H EXTRUSIONHeat Sink...

MHST10055 Allicdata Electronics
PH3-300-300-0.21-1A

IR HEAT SPREADER/EMITTER W/ADHHeat Sink ...

PH3-300-300-0.21-1A Allicdata Electronics
132-11B9

HEATSINK EXTRUDEDHeat Sink

132-11B9 Allicdata Electronics
413F

HEATSINK POWER TO-3Heat Sink

413F Allicdata Electronics