ATS-12E-194-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS20970-ND

Manufacturer Part#:

ATS-12E-194-C2-R0

Price: $ 3.52
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12E-194-C2-R0 datasheetATS-12E-194-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.20040
10 +: $ 3.11472
25 +: $ 3.03055
50 +: $ 2.86209
100 +: $ 2.69375
250 +: $ 2.52542
500 +: $ 2.44124
1000 +: $ 2.18870
Stock 1000Can Ship Immediately
$ 3.52
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 13.07°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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ATS-12E-194-C2-R0 Application Field and Working Principle

Thermal - Heat Sinks are an important component of any electronics application. The ATS-12E-194-C2-R0 is a high-performance thermally effective and cost-effective thermal conductive product. With an optimal design and superior thermal conductivity, it is the perfect choice when it comes to dissipating heat in applications that require high power electronics.

The ATS-12E-194-C2-R0 has a thermal conductivity of 1.4 W/m-K and a low resistance, which makes it a great thermal interface material for applications such as cooling of CPU, GPU, and other high-power components. The thermal conductive plate has a thermally conductive silicone compound infill and an area that can easily be used to drill separate locations for attaching components. The ATS-12E-194-C2-R0 also features a circuit board that is EMI resistant, allowing for better heat dissipation.

Applications of ATS-12E-194-C2-R0

The ATS-12E-194-C2-R0 is used in a variety of electronic applications, including LED-based lighting, robotics, and communications equipment. Due to its extremely effective performance, it can easily be used to dissipate heat in high wattage circuits such as power supplies, converters, high power DCDC converters, and audio amplifiers.

It is also used in medical applications, regenerative medicine, machinery, consumer electronics, handheld devices, and even automotive applications. Since it is both efficient and effective, it is often used to reduce energy consumption with systems that require cooling solutions. Furthermore, the ATS-12E-194-C2-R0 can be employed in embedded systems and automated processes, thus simplifying development.

Working Principle of ATS-12E-194-C2-R0

The working principle behind the ATS-12E-194-C2-R0 is relatively simple. It is based on the fact that heat always seeks areas of less resistance. The device is designed to capture heat produced by components and then divert it away from the working area of the device. It is then released into areas where there is less resistance, such as open air or a liquid medium.

The ATS-12E-194-C2-R0 is composed of a silicone-based compound that acts as a thermal transfer agent. This compound transfers thermal energy from the components onto the ATS-12E-194-C2-R0 thermal plate. The plate then uses its high thermal conductivity to effectively dissipate heat to its surrounding environment.

The ATS-12E-194-C2-R0 is a very effective device when it comes to cooling down electronic components. It features an optimal design that is very efficient at dissipating thermal energy. Furthermore, it is relatively inexpensive compared to other cooling solutions, making it a great choice for applications that require thermal management solutions.

The specific data is subject to PDF, and the above content is for reference

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