ATS-12E-197-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS20973-ND

Manufacturer Part#:

ATS-12E-197-C2-R0

Price: $ 3.76
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12E-197-C2-R0 datasheetATS-12E-197-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.42090
10 +: $ 3.32892
25 +: $ 3.23870
50 +: $ 3.05878
100 +: $ 2.87885
250 +: $ 2.69892
500 +: $ 2.60896
1000 +: $ 2.33906
Stock 1000Can Ship Immediately
$ 3.76
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.90°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction to Thermal - Heat Sinks

Thermal - Heat Sinks are components that dissipate heat from one source and transfer it to another, allowing for a temperature to be maintained within an appliance. They often consist of a heat-conducting material, such as metal, which is surrounded by fins. Heat sinks absorb heat from a device and transfer it away from the device in order to cool it down and avoid overheating. Thermal - Heat Sinks can be found in many consumer and industrial devices, such as computers, servers, and medical devices.

ATS-12E-197-C2-R0 application field and working principle

The ATS-12E-197-C2-R0 is a thermal - heat sink designed for use in cooling applications. It is designed to dissipate the heat generated by electronic components and other heat-generating devices. The heat sink is made from an anodized aluminum, and is equipped with multiple fins for increased surface area, which helps dissipate heat more efficiently. The ATS-12E-197-C2-R0 uses a combination of convection, conduction, and radiation to transfer heat away from the device and towards the heat sink. The convection process involves the heat being transferred from the surface of the device to the air, while the conduction and radiation processes involve the transfer of heat from the device to the heat sink. The heat sink then dissipates the heat through the fins, allowing the device to cool down and run more efficiently.

Conclusion

Thermal - Heat Sinks are an important part of many cooling applications, and the ATS-12E-197-C2-R0 is an ideal solution for dissipating heat from electronics and other heat-generating devices. It is designed to efficiently transfer heat away from the device, using a combination of convection, conduction, and radiation, and dissipating the heat through the multiple fins. The ATS-12E-197-C2-R0 heat sink is reliable, efficient, and easy to install, making it an ideal solution for cooling applications.

The specific data is subject to PDF, and the above content is for reference

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