ATS-12E-198-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.472" (12.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.21°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-12E-198-C3-R0 Application Field and Working Principle

Thermal - Heat Sinks are essential components for dissipating heat in a variety of electronic devices. The ATS-12E-198-C3-R0 is a high performance thermal heat sink solution that can be used to help improve the performance and reliability of many applications. This article will discuss the application field and working principle of the ATS-12E-198-C3-R0.The ATS-12E-198-C3-R0 was designed specifically for use in high-performance data storage, server and networking applications. It features an advanced fin design that can dissipate large amounts of heat efficiently and effectively. In addition, the heat sink also has a robust structure allowing for easy installation, even in tight spaces. The heat sink is made from high quality aluminum with a black finish, making it ideal for use in a variety of applications.The ATS-12E-198-C3-R0 works by thermally conducting heat away from the component it is attached to. It does this by utilizing the principles of thermal conductance. This means that when heat is present, the heat sink absorbs it and transfers it away from the component. This is done by allowing the heat sink to spread the heat to a larger metal area and thus dissipating it more efficiently.The ATS-12E-198-C3-R0 has a number of advantages over other heat sinks available on the market. Firstly, it is designed to provide maximum heat transfer efficiency. This is achieved due to the use of an optimized fin surface area, which ensures that the heat sink is able to dissipate heat away from the component quickly and effectively. In addition, it is also designed to be simple to install and maintain.The ATS-12E-198-C3-R0, with its robust design and efficient cooling, is an excellent choice for cooling procedures in many industries, including data storage, networking, and electronics. Its large fin surface area allows for maximum thermal efficiency, and its black finish allows it to blend seamlessly into any environment. Furthermore, its ease of installation, maintenance, and upgrade allow it to be easily integrated into various industrial and commercial applications.Overall, the ATS-12E-198-C3-R0 is an excellent solution for cooling large data storage and server components, as well as other electronic products. It is designed to provide maximum thermal efficiency and its robust construction makes it easy to install, maintain, and upgrade. The ATS-12E-198-C3-R0 provides a perfect balance of performance and value, making it an ideal choice for any thermal cooling requirement.

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