ATS-12E-199-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.236" (6.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	15.95°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-12E-199-C3-R0 is a versatile and effective heat sink designed to manage thermal energy in a wide range of systems. Featuring a design optimized for near-zero thermal resistance, this device is capable of dissipating up to 400 watts of thermal energy, allowing it to effectively cool basic systems and environments. To be effective, the device must be installed securely so that it does not interfere with other components, as well as a solution that is custom tailored to maximize performance.

Application Field

The ATS-12E-199-C3-R0 thermal management device is used in a number of different systems, including telecom, medical as well as military applications. Depending on the specific requirements, this device can provide significant energy saving solutions and decrease maintenance costs.For telecommunications applications, this device is ideal for cooling high-powered transceivers as it can help regulate temperature, thus preventing thermal runaway situations and reduce energy consumption. It is highly effective in controlling ambient temperatures of telecommunication systems and allows for high power dissipations.The medical industry also stands to benefit from the use of the ATS-12E-199-C3-R0 device. By regulating temperatures, the device helps to ensure that components remain operational and function efficiently. It can help protect sensitive components while at the same time providing a reliable thermal management solution.Finally, the ATS-12E-199-C3-R0 is suitable for a variety of military applications such as missiles, satellites and jet propulsion systems. Its advanced design ensures excellent thermal conductivity and is capable of dissipating thermal energy from high performance tools in a safe and efficient manner.

Working Principle

The ATS-12E-199-C3-R0 utilizes a combination of materials and designs, which allow for its excellent thermal energy dissipation capacity. It features a unique combination of metals, such as aluminum and copper, that allows for effective heat management. The metal fins on the device are specially designed to maximize air circulation throughout the device to minimize any effects of heat build-up.The design of the ATS-12E-199-C3-R0 also helps to reduce operating temperatures and improve system performance. Its design is built to maximize thermal resistance in order to ensure that the air flow is evenly distributed throughout the device and that the overall temperature stays at a constant level. This prevents any excess heat build-up throughout the system and ensures the efficient removal of heat.The ATS-12E-199-C3-R0 also features a unique design which ensures that there is no disruption to the airflow within the system. This device is designed to maximize cooling and prevent warm air pockets from accumulating in the system, thus increasing the overall efficiency of the device.

Conclusion

The ATS-12E-199-C3-R0 heat sink is a reliable and efficient thermal management device designed to reduce temperature in a variety of applications from telecoms to medical and military. It utilizes a combination of metals and unique design features which allow for maximum air flow and effective thermal management. This device is ideal for high-powered systems as it can help to regulate temperature efficiently and prevents thermal runaway situations.

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