| Allicdata Part #: | ATS-12E-209-C1-R0-ND |
| Manufacturer Part#: |
ATS-12E-209-C1-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12E-209-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a key element in successful product design. Heat generated by electronic systems must be efficiently removed from the device in order to maintain proper system operation. The ATS-12E-209-C1-R0 heat sink is designed to offer reliable cooling solutions for a variety of thermal-related applications. This article will discuss the application fields and working principles of the ATS-12E-209-C1-R0 heat sink.
The ATS-12E-209-C1-R0 heat sink uses a simple concept to achieve efficient thermal management. The heat sink has a large finned surface area that dissipates heat from the device through the dissipation of thermal radiation. Heat is generated inside the device by electrical components and is conducted through the heat sink’s finned surface area where it is dispersed to the surrounding environment. This cooling method is effective for a wide range of applications and is popular due to its low cost and simple installation.
The ATS-12E-209-C1-R0 heat sink is designed to provide reliable cooling solutions in a wide range of applications. This heat sink can be used in computers, telecommunications, industrial electronics, medical devices, and many other electronic systems. It is also a popular choice for cooling applications in automobiles, home appliances, and power supplies. The ATS-12E-209-C1-R0 is specifically designed to function at temperatures up to 200° F (93° C), making it an ideal choice for high-temperature devices.
The ATS-12E-209-C1-R0 heat sink offers high-performance cooling solutions in a variety of application fields. The heat sink’s large finned surface area allows it to effectively dissipate heat from a wide variety of devices. The multiple fins increase the heat rejection surface area and allow for effective cooling, even at high temperatures. The ATS-12E-209-C1-R0 also utilizes convection cooling, where an airflow from the surrounding environment dissipates heat from the fins.
The ATS-12E-209-C1-R0 heat sink offers reliability and performance in a variety of applications. Its simple installation and low cost make it an ideal choice for many industries. In addition, the ATS-12E-209-C1-R0 offers effective thermal management that enables efficient and reliable cooling solutions. As a result, this heat sink is a popular choice for a variety of thermal-related applications.
The specific data is subject to PDF, and the above content is for reference