| Allicdata Part #: | ATS-12E-210-C1-R0-ND |
| Manufacturer Part#: |
ATS-12E-210-C1-R0 |
| Price: | $ 5.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12E-210-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.78863 |
| 30 +: | $ 4.52256 |
| 50 +: | $ 4.25653 |
| 100 +: | $ 3.99055 |
| 250 +: | $ 3.72451 |
| 500 +: | $ 3.45848 |
| 1000 +: | $ 3.39196 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.17°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are devices designed to conduct heat away from a hot surface. They are commonly used in the cooling of electronic components and systems. The ATS-12E-210-C1-R0 is a heat sink specifically designed for application in cooling electronic components such as transistors, chips and other semi-conductors.
Application Field
The ATS-12E-210-C1-R0 is a small, lightweight heat sink for direct application to electronic components, including transistors, chips and other semi-conductors. It is often used in the cooling systems of consumer electronic products such as computers, tablets, smartphones, and other electronic devices. It is also well-suited for use in industrial electronic control systems, sub-systems, and other applications requiring heat dissipation.
Working Principle
The ATS-12E-210-C1-R0 heat sink is designed to dissipate heat energy away from hot electronic components. The heat sink features a special extruded aluminum alloy construction, which offers superior thermal properties. The heat sink is also equipped with a line of fins, which are designed to increase the surface area available for heat dissipation. The fins are designed in an efficient manner, which allows for maximum heat dissipation.
The ATS-12E-210-C1-R0 heat sink is also equipped with a heat transfer plate. The plate is designed to conduct heat to a secondary plate or other device with a higher thermal conductivity. This helps to reduce the amount of heat that accumulates within the heat sink and improves the efficiency of the cooling system. The combination of the aluminum alloy fins, the heat transfer plate, and the heat dissipation characteristics of the ATS-12E-210-C1-R0 make it an ideal choice for cooling applications.
Conclusion
The ATS-12E-210-C1-R0 heat sink is a lightweight, efficient heat sink designed for cooling electronic components. The extruded aluminum alloy construction provides superior thermal properties, and the fins increase the surface area available for heat dissipation. The Heat Transfer Plate allows for improved cooling efficiency, and the combined effects of these components make this heat sink an ideal solution for a variety of applications.
The specific data is subject to PDF, and the above content is for reference