ATS-12E-27-C2-R0

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Thermal management is an essential component for a wide variety of application fields, including consumer electronics, automotive, industrial, and medical. Heat sink components are vital to the proper cooling of components and systems to avoid overheating and maintain efficiency. ATS-12E-27-C2-R0 is a heat sink product from the ATS family of products. It is a pin-fin heat sink with a matching clip, making it an ideal choice for applications that require a small size with maximum heat dissipation performance.

Overview

The ATS-12E-27-C2-R0 is a pin-fin heat sink made of anodized aluminum. The heat sink measures 12.1mm x 12.1mm x 27.5mm, making it small enough for applications that have tight space requirements. It features a maximum capacity of 4.9W TDP, which makes it suitable for low-power applications. Its dissipation performance is enhanced by tiny pins that provide more surface area for better heat dissipation. The ATS-12E-27-C2-R0 also comes with a matching clip to securely attach it to components.

Application Fields

The ATS-12E-27-C2-R0 is suitable for applications in fields such as consumer electronics, automotive, industrial, and medical. It is well-suited for low-power applications such as medical devices, telecom solutions, consumer electronics and IoT devices. Additionally, it can be used for low-power industrial systems such as system boards, embedded boards and fanless systems. The ATS-12E-27-C2-R0 can also be used in automotive applications such as infotainment systems and vehicle control systems.

Working Principle

Heat sink products employ the principle of thermodynamics to dissipate heat from the component or system. Heat moves from a region of higher temperature to a region of lower temperature. The ATS-12E-27-C2-R0, with its anodized aluminum construction, acts as a heat conductor. The multiple pins create a larger surface area to remove heat from components. This heat is then transferred to the surrounding air by conduction, which is the process of heat transfer through direct contact with a solid material. The conduction process is further enhanced by convection, which is the transfer of heat to a gas or liquid as the molecules move from a high to a low energy level. As air passes by the heat sink, the heat is dissipated.

Conclusion

Heat sink products are essential components for thermal management. The ATS-12E-27-C2-R0 is a pin-fin heat sink with an anodized aluminum construction that measures 12.1mm x 12.1mm x 27.5mm and has a maximum capacity of 4.9W TDP. It is suitable for a variety of applications in fields such as consumer electronics, automotive, industrial, and medical. The principle of thermodynamics is used to dissipate heat from components and systems, with conduction and convection acting as primary drivers.

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