ATS-12E-27-C3-R0

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Thermal management has been a major challenge for most electronic applications. Heat transfer is regulated through natural convection, heat dissipation, and other methods including cooling fans, liquid or air cooling, and other options. Heat sinks are used to take the heat generated by an electronic device and divert it to other areas. The ATS-12E-27-C3-R0 Heat Sink is one of several types of products offered by Amphenol Thermal Technologies that work well for large and small applications alike.

The ATS-12E-27-C3-R0 Heat Sink is designed to provide temperature management options in various electronic applications. It is composed of aluminum fins and is capable of dissipating heat quickly and evenly. The special open design of the fins allows for quick thermal response while still maintaining optimal airflow within the enclosure. The heat sink has a low profile design which contributes to its space saving characteristics. This allows the ATS-12E-27-C3-R0 to be easily installed in tight spaces, improving the thermal management efficiency of the application.

In terms of performance, the ATS-12E-27-C3-R0 Heat Sink is rated with a thermal resistance of 0.17 sq ft/W and can pass thermal conditions up to 3000W. The heat is spread across its fins, allowing for consistent heat transfer which makes it a good choice for applications that require reliable heat management. It is also equipped with a special clip-on base which allows for easy installation and removal. This base provides an added benefit of better thermal performance and stability during operation.

The ATS-12E-27-C3-R0 Heat Sink is most commonly used in computer systems, high-end processors, GPUs, CPUs, power supplies, and other electronic components that require efficient heat management. In addition to dissipating heat, it can also act as a heatsink for a device, absorbing the excess heat from the device and dissipating it in the air. This helps to reduce the risk of your device overheating, increasing its longevity.

The working principle of the ATS-12E-27-C3-R0 Heat Sink is that it absorbs the heat from an electronic component, dissipating it through the fins and transferring it to the surrounding air. The design of the fins allows for a larger surface area to absorb more thermal energy, providing a better cooling performance. This heat is then dispersed in a uniform way, allowing the device to stay cool while it is in operation. As the fins are spread evenly, they help to reduce any hot spots that might be created by the electronic device.

In conclusion, the ATS-12E-27-C3-R0 Heat Sink is designed to provide efficient thermal management options in a variety of electronic applications. It is constructed from aluminum fins and offers a low profile which helps to save space in the application. The heat transfer process is managed by an efficient thermal resistance rating of 0.17 sq ft/W and is capable of handling temperatures up to 3000W. Its clip-on base helps improve thermal performance and stability during operation. The overall design of the ATS-12E-27-C3-R0 Heat Sink spreads thermal energy evenly, reducing the risk of device overheating and helping to increase its longevity. The heat sink is most commonly used in computer systems, high-end processors, GPUs, and power supplies, and other electronic components that require efficient heat management.

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