
Allicdata Part #: | ATS-12E-48-C1-R0-ND |
Manufacturer Part#: |
ATS-12E-48-C1-R0 |
Price: | $ 3.70 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 25X25X35MM L-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.36420 |
30 +: | $ 3.27348 |
50 +: | $ 3.09154 |
100 +: | $ 2.90972 |
250 +: | $ 2.72785 |
500 +: | $ 2.63691 |
1000 +: | $ 2.36412 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 0.984" (25.00mm) |
Width: | 0.984" (25.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.378" (35.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.44°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are devices used to dissipate heat from an electronic component or device. The ATS-12E-48-C1-R0 is a high performance, forced convection heat sink designed for use in high power thermal management applications. It is made of aluminum alloy extrusion die-cast for optimal performance and reliability. It has a unique fin design to provide enhanced convective airflow and an optimized surface area for superior thermal impedance.
The ATS-12E-48-C1-R0 is a great choice for applications requiring forced convection cooling, such as in the semiconductor and consumer electronics industries. The heat sink features a high-efficiency heating element, a large single-piece fin structure for increased airflow, and a strong-built frame to ensure reliable operation. It also features a unique C1-R0 connector, which facilitates easy installation.
The ATS-12E-48-C1-R0 heat sink offers superior thermal management capabilities. It is designed with an optimized fin pattern to ensure increased convective cooling. The fin design also enhances the air flow for superior cooling performance. The fin pattern also maximizes the surface area for ideal heat dissipation. The C1-R0 connector allows the heat sink to be connected to any type of power supply, making it an ideal choice for use in small or tight configurations.
The ATS-12E-48-C1-R0 is highly efficient at dissipating heat from electronic components and devices. Its unique fin design ensures maximum convective airflow and optimal thermal resistance. The fin design also maximizes the overall surface area for effective heat dissipation. Its C1-R0 connector allows for easy installation and high flexibility in various configurations. Overall, the ATS-12E-48-C1-R0 is a great choice for high power thermal management applications.
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