ATS-12E-49-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-12E-49-C1-R0-ND

Manufacturer Part#:

ATS-12E-49-C1-R0

Price: $ 3.17
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X10MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12E-49-C1-R0 datasheetATS-12E-49-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.87721
30 +: $ 2.79909
50 +: $ 2.64361
100 +: $ 2.48812
250 +: $ 2.33264
500 +: $ 2.25488
1000 +: $ 2.02162
Stock 1000Can Ship Immediately
$ 3.17
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 26.32°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal cooling is an important factor when it comes to the performance and reliability of electronics. Heat sinks, which act as passive cooling solutions for components, are an important part of this. ATS-12E-49-C1-R0 is a thermal heat sink designed for high-performance applications.

As the name implies, this heat sink is specifically designed for cooling electronic components. It is made of aluminum, which is a lightweight, strong, and durable metal. This heat sink has an efficient air fin design, which optimizes its performance. The fins have a convex and concave shape that helps draw in air and allows for the most efficient heat transfer.

This heat sink is designed for components with high thermal loads, such as processors, graphics cards, and power supply units. The size of the heat sink is important as it needs to be large enough to effectively transfer heat away from the component but not too large as to cause an airflow issue. As such, the ATS-12E-49-C1-R0 is designed to handle small to midsize components with ease.

The ATS-12E-49-C1-R0 features an extruded aluminum body with a copper heat spreader plate. This heat spreader efficiently pulls heat away from the component, making it an ideal choice for high-thermal load environments. The solid construction of the heat sink also contributes to its effectiveness, with a tighter fit and optimal air flow.

The ATS-12E-49-C1-R0 is capable of cooling components up to 150 W. This is ideal for most applications, as the heat is efficiently managed without the risk of overheating. The heat sink is also low profile, making it suitable for tight spaces. Additionally, the heat sink is compatible with most popular fan mounts and has four mounting holes.

The working principle of the ATS-12E-49-C1-R0 is quite straightforward. It uses convection to dissipate heat away from the component. The air fins, which are designed to maximize the exposure to airflow, draw air in while the heat spreader pulls heat away from the component. This heat is then dissipated into the surrounding environment through the air fins.

Overall, the ATS-12E-49-C1-R0 thermal heat sink is an excellent choice for a variety of applications, thanks to its efficient air fin design, solid construction, and compatibility with popular fan mounts. It is capable of cooling components up to 150 W, and its low-profile design makes it ideal for use in tight spaces. Additionally, the working principle of the heat sink is easy to understand and efficient in dissipating heat away from the component.

The specific data is subject to PDF, and the above content is for reference

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