ATS-12E-87-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	13.30°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-12E-87-C3-R0 Application Field and Working Principle

Thermal - Heat Sinks are a type of thermoelectric cooling device that uses a simple principle to cool electronic components. The most common type of these cooling devices is the ATS-12E-87-C3-R0. It is designed to work in a wide array of applications and is one of the most popular thermal - heat sinks in the market today. To understand more about this popular type of cooling device and its application field and working principle, it is important to know what it entails. The ATS-12E-87-C3-R0 is a single stage, vertical finned, heat pipe cooled thermal - heat sink. It features four metal fins that are arranged vertically in a three-dimensional array. This array allows for optimal thermal performance in a wide variety of applications. The design of the fins helps to facilitate an even heat distribution across the surface area of the heat sink. The ATS heat sinks are designed to be used in both air & liquid cooled applications.The ATS-12E-87-C3-R0 is designed to provide maximum thermal transfer and performance in applications with cooler temperatures. The sink is designed to take advantage of the best cooling environment. This sink is extremely effective in its ability to dissipate heat due to its special fin design and honeycomb configuration that provides for even cooling results. At the core of the ATS-12E-87-C3-R0 is its thermal - heat transfer principle and methodology. Heat is transferred in a thermal gradient from an area of high temperature to areas of lower temperature. In a vertically-oriented Thermal - Heat Sink, the hottest component is located on the top and the coldest component is located on the bottom. The heat transfer takes place in a continuous cycle, allowing for a steady flow of thermal energy from the hot area to the colder areas. When the ATS-12E-87-C3-R0 is installed in an application, it uses its vertical fin array to efficiently dissipate the heat generated by components. As the heat is dissipated, it is transferred to the environment that surrounds the heat sink, allowing it to be cooled and dissipated. This helps the components from the application to stay at cooler temperatures, allowing for a better performance. The ATS-12E-87-C3-R0 is designed to operate in a variety of applications and environments. It can be used in high-end servers and other heavily loaded computer systems, as well as in industrial, automotive, military and electronics applications. Due to its innovative design, this thermal - heat sink is more efficient and durable. This allows it to function in a wide range of applications for longer periods of time with more consistent performance. The ATS-12E-87-C3-R0 is a very versatile and reliable thermal - heat sink that is designed to provide superior thermal transfer in a wide range of applications and environments. Its unique design allows for an even heat distribution and effective cooling even in the most demanding applications. This type of heat sink is popular in industrial and automotive applications due to its durability and long lifespan. With its high-quality design, this thermal - heat sink provides an excellent solution for a variety of applications and can help keep components from getting overheated.

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