| Allicdata Part #: | ATS-12E-93-C3-R0-ND |
| Manufacturer Part#: |
ATS-12E-93-C3-R0 |
| Price: | $ 4.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12E-93-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.78252 |
| 30 +: | $ 3.57231 |
| 50 +: | $ 3.36206 |
| 100 +: | $ 3.15195 |
| 250 +: | $ 2.94182 |
| 500 +: | $ 2.73169 |
| 1000 +: | $ 2.67917 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a key component of a system when it comes to dissipating the heat generated by the components. The ATS-12E-93-C3-R0 is a type of thermal heat sink specifically designed to provide an efficient thermal interface between the surface of the component and the air.
Specifically, the ATS-12E-93-C3-R0 is a highly engineered heat sink that uses an EPDM (Ethylene Propylene Diene Monomer) fin that is specifically designed to provide enhanced thermal performance. The fin is further optimized with a unique stud mounting system that reduces the risk of component damage, offers superior pressure distribution, and includes strong detent clips for easier installation.
When it comes to the performance aspects of the ATS-12E-93-C3-R0, it is capable of providing an effective thermal solution by providing a range of air flow from low to high. This is impressive considering its relatively small and lightweight size. In addition, it also features a strong and robust design, which makes it capable of withstanding temperatures up to 300°C.
The ATS-12E-93-C3-R0 is primarily used in applications that require efficient and effective thermal management. This includes a range of devices such as computers, smartphones, tablets, and other electronic devices. The heat sink\'s low profile allows for easy mounting and use and it is also capable of absorbing the hottest surface temperatures without compromising on performance.
The overall working principle of the ATS-12E-93-C3-R0 is quite simple. It works by absorbing the heat created by the surface of the component, transferring it away from the surface, and efficiently dissipating it into the surrounding environment. This is achieved by the combination of its aluminium fins, which allows for increased heat transfer, and EPDM fin which directs the airflow around the fins.
The ATS-12E-93-C3-R0 is an extremely reliable and effective heat sink solution that can be used in a variety of different applications. Its low-profile design allows for easy mounting and use and it also features superior thermal performance. In addition, its robust design makes it capable of withstanding temperatures up to 300°C with no compromise on performance.
The specific data is subject to PDF, and the above content is for reference