| Allicdata Part #: | ATS-12F-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-12F-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12F-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a vital component in the design of any electronic device, providing reliable thermal management solutions that can improve product performance. The ATS-12F-10-C1-R0 series heat sink is designed for a wide range of applications, incorporating advanced thermal performance and advanced design principles into a slim, low-profile design. In this article, we will discuss the specific application field for the ATS-12F-10-C1-R0, as well as its working principle.
Application Field
The ATS-12F-10-C1-R0 heat sink is designed for a variety of applications, from commercial to industrial. In particular, this heat sink is ideal for applications which require a high thermal power or require a high reliability. It is also suitable for use in applications with low fan noise. With a slim, low-profile design, the ATS-12F-10-C1-R0 can be used in environments with limited space. Common applications include power supplies, drives, 3D printers, inverters, line-frequency motors and solar power controllers.
This heat sink is designed to work in conjunction with a range of thermal interface materials, making it suitable for applications with extreme temperatures. It is also capable of supporting multiple-capacity loads, allowing it to be used as a common heat sink in complex systems. Additionally, this model is available with a wide range of fasteners for different mounting options.
Working Principle
The ATS-12F-10-C1-R0 utilizes a combination of design features to improve its thermal performance. These design features include a thin profile for improved heat conduction, fins that help dissipate the heat, a base plate that serves as a heat spreader, and copper bars to draw heat away from the fins. This heat sink also incorporates advanced materials, such as a high-performance aluminum alloy, which help to quickly dissipate heat.
The ATS-12F-10-C1-R0 is designed to work with a range of thermal interface materials, from thermal pads to thermal grease. This allows the heat sink to be effectively coupled to the device it is cooling, allowing for more efficient heat transfer. Additionally, the use of these materials helps to ensure that the device is not damaged by overheating. Additionally, this heat sink incorporates an array of fasteners, allowing for flexible mounting options.
The ATS-12F-10-C1-R0 heat sink is designed to provide reliable thermal performance for a variety of applications. It is particularly suitable for use in applications that require a slim, low-profile design, as well as those that require a high thermal power or require a high reliability. Additionally, this model is available with a wide range of fasteners, making it ideal for applications with limited space. The ATS-12F-10-C1-R0 heat sink is a powerful and reliable solution for maintaining safe operation in a range of applications.
The specific data is subject to PDF, and the above content is for reference