ATS-12F-10-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.89°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-12F-10-C2-R0 Thermal - Heat Sinks

Thermal - Heat Sinks are an essential component for any electronics device. They are designed to dissipate the heat generated from the devices and protect them from burning out. The ATS-12F-10-C2-R0 heat sink is a special kind of heat sink designed to provide efficient cooling in a highly constrained space. ATS-12F-10-C2-R0 is a Thermal - Heat Sink which is able to dissipate approximately 12 watts of thermal power, and is used in an array of applications.

Overview of the ATS-12F-10-C2-R0 thermal - heat sink

The ATS-12F-10-C2-R0 heat sink is an anti-bacteria coated aluminum heat sink designed to dissipate 12 watts of thermal power. Its thermal design includes fin spacing of 10 cm2, which allows for high rates of heat dissipation in constrained spaces. It measures 128.71mm in length, 71.4mm in width and 23.81mm in height. It is weight is 170g. The thermal design of ATS-12F-10-C2-R0 includes a fin spacing of 10 cm2.The ATS-12F-10-C2-R0 is a standard sized heat sink. It has four 40mm cooling holes that allow for maximum air flow through the device, thereby maximizing the cooling effect. The heat sink is manufactured with one notch at the shop level and is machined to include a dielectric strength of > 500 VAC.

Application Field and Working Principle

The ATS-12F-10-C2-R0 heat sink is suitable for a variety of applications. In general, it is used in devices such as embedded computing devices, communication systems, servers, and other power electronics. It can also be used in space-constrained applications such as small PCB boards, storage solutions, handheld devices, and other consumer electronics.The ATS-12F-10-C2-R0 heat sink works on a principle of thermal conductivity. This means that heat is dissipated from a hot source to a cooler environment. This process is accelerated by heat sinks which provide an additional area for heat exchange. With the four cooling holes, the ATS-12F-10-C2-R0 allows for maximum air flow through the device, thereby allowing maximum cooling effect. In addition, the anti-bacterial coating helps to reduce the growth of bacteria, helping to ensure cleanliness and hygiene.

Advantages of ATS-12F-10-C2-R0 Heat Sinks

The ATS-12F-10-C2-R0 heat sink is a highly efficient cooling solution which provides a number of advantages over other types of heat sinks. Its fin spacing of 10 cm2 enables efficient cooling in a highly constrained space, while its anti-bacterial coating helps to ensure cleanliness and hygiene. The heat sink is also designed to provide maximum airflow, which helps to maximize the cooling effect. Additionally, its dielectric strength of >500 VAC prevents interference from external electromagnetic fields. The ATS-12F-10-C2-R0 is therefore an ideal choice for a variety of electronic applications.

Conclusion

The ATS-12F-10-C2-R0 thermal - heat sink is a reliable and efficient cooling solution that is suitable for a variety of applications. It has an anti-bacterial coating to ensure cleanliness and hygiene, and its fin spacing of 10 cm2 provides for efficient heat exchange in highly constrained spaces. The heat sink also has four cooling holes to maximize air flow, and a dielectric strength of >500 VAC to prevent interference from external electrical fields. As such, the ATS-12F-10-C2-R0 heat sink is an ideal choice for any device requiring efficient cooling.

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