| Allicdata Part #: | ATS-12F-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-12F-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12F-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential factor of any electronic device or system, as temperature control plays a key role in ensuring the long-term performance and reliability of any electronic equipment. Heat sinks, as a thermal management component, help dissipate the heat generated by the electronic components and allow the device to run at a cooler temperature for improved efficiency. The ATS-12F-10-C3-R0 is a high-efficiency, compact single-phase heat sink designed for applications where space is a premium. This thermal heat sink is capable of transferring heat to the ambient air at a higher rate than conventional heat sinks, allowing for efficient cooling in tight installation spaces.
The ATS-12F-10-C3-R0 is a great choice for those constrained by space limitations, as its height and weight are about 25 to 30% lower than conventional heat sinks. While designed to fit in a variety of narrow spaces, the capacity of the ATS-12F-10-C3-R0 should not be underestimated. The heat sink is designed with a copper fin core and a die-cast aluminum housing that ensures effective and long-term heat dissipation. Additionally, the aluminum housing is resilient to environmental stress and corrosion, which grants this thermal management component a longer lifespan.
The ATS-12F-10-C3-R0’s thermal efficiency is enabled by its proprietary fan and fin structure design. The cooling fan is located over the heat sink fins so as to provide a uniform flow of air along the entire fin array. This design ensures a passive cooling system with maximum air flow. Furthermore, the heat sink is also designed with multiple layers of fins, providing a larger air-to-surface area ratio for maximum heat transfer.
The ATS-12F-10-C3-R0 heat sink is capable of dissipating heat in environments up to 80°C, making it perfect for use in high temperature industrial applications. Its dimensions, 39.3mm × 32 mm × 14mm, make this thermal heat sink suitable for use in highly compact areas and its lasting aluminum housing also makes it insensitive to black staining. The ATS-12F-10-C3-R0 is a great choice for those looking for a reliable and highly efficient thermal management solution for their high-temperature electronic applications.
The specific data is subject to PDF, and the above content is for reference