| Allicdata Part #: | ATS-12F-100-C3-R0-ND |
| Manufacturer Part#: |
ATS-12F-100-C3-R0 |
| Price: | $ 4.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12F-100-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.22163 |
| 30 +: | $ 3.98727 |
| 50 +: | $ 3.75278 |
| 100 +: | $ 3.51823 |
| 250 +: | $ 3.28369 |
| 500 +: | $ 3.04914 |
| 1000 +: | $ 2.99050 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
A thermal heat sink is a device used to dissipate heat away from a component. The ATS-12F-100-C3-R0 thermal heat sink is a conventional heat sink designed for integrated circuits and LEDs. The device utilizes a combination of aluminum fins and copper heat dissipation components to efficiently dissipate heat quickly, allowing the operator to maintain a cool system and prevent the component from overheating.
The ATS-12F-100-C3-R0 is designed using 200 pieces of aluminum fins, which are organized in a parallel arrangement for maximum heat dissipation. The heat sink also has a copper base to help facilitate proper heat transfer from the component to the fins. The fin pitch is 0.4mm thick, allowing for a larger surface area for heat transfer. The fins are curved, making it possible to capture more air surrounding the component and therefore assistance in improving engine cooling performance. The fins also feature pinnacles, which increase contact with surrounding air, allowing for further heat dissipation.
Aside from aluminum fins, the ATS-12F-100-C3-R0 heat sink also consists of a copper base plate. The copper base plate is necessary to ensure that the heat is properly transferred from the component to the fins. The copper base plate measures 26mm x 26mm, making it a perfect size for the component being cooled. The copper used in the copper base plate promises a stable surface for heat dissipation and reduces the risk of thermal loss.
To further ensure it dissipates heat effectively, the ATS-12F-100-C3-R0 is supplemented with a thermal adhesive and thermal grease. Thermal adhesive and thermal grease are applied between the component and the copper base plate, which ensures that the component is tightly secured and the heat is adequately transferred to the heat sink. The thermal adhesive and thermal grease are necessary because it helps reduce the thermal resistance between the component and the copper base plate.
The efficiency of the ATS-12F-100-C3-R0 thermal heat sink is further increased when combined with a fan. Not only do the fans increase airflow between the fins, but it also helps draw the hot air away from the component, ensuring that the heat is dissipated more quickly. This is beneficial as it helps prevent the component from overheating.
Overall, the ATS-12F-100-C3-R0 thermal heat sink is an effective device for dissipating heat away from delicate components. The combination of aluminum fins and a copper base helps ensure the heat is efficiently dissipated, while the use of thermal adhesive and thermal grease further helps improve heat transfer. Additionally, the addition of a fan helps draw the hot air away from the component, making it more efficient at dissipating heat.
The specific data is subject to PDF, and the above content is for reference