ATS-12F-105-C1-R1

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	1.772" (45.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.374" (9.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	28.19°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-12F-105-C1-R1 Thermal - Heat Sinks

Thermal - heat sinks are used to dissipate heat from the components of electronic systems in order to keep these components from running too hot. The ATS-12F-105-C1-R1 (ATS 2F1) is a thermally enhanced heat sink module specifically designed for hot components such as processors, FPGAs, memory, and power components.The ATS-12F-105-C1-R1 is constructed with anodized aluminum material that is lightweight and corrosion resistant. It features a five-layer fins design which includes four air-through fins and one dissipating fin. This design allows for maximum thermal performance and increased surface area to support higher output power components and longer system life. Air-through fins, which are small fins directly connected to the base, provide a path for airflow directly to the dissipating fin. This design helps ensure the best thermal transfer possible.The base of the module is designed for use with a thermal adhesive for added thermal performance. The adhesive promotes adhesion to the base material and can help reduce heat dissipation time. This is especially helpful when dealing with power components, which require additional heat dissipation.The ATS-12F-105-C1-R1 features an integrated control system with the ability to adjust fan and power levels. This feature allows users to regulate the amount of airflow to the components and helps ensure components run at the most optimal temperature. Users also have the option to choose between different power levels, depending on their requirements. This helps users save energy and cost.The module is also equipped with an LED indicator light that aids in troubleshooting. It is designed for use in both open-loop and closed-loop control systems.In summary, the ATS-12F-105-C1-R1 heat sink module is an ideal solution for thermal cooling needs, with its lightweight aluminum construction, air-through fins design, and built-in control system. It is the perfect choice for processors, FPGAs, memory, and power components in order to ensure long system life and optimal performance.

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