| Allicdata Part #: | ATS-12F-11-C1-R0-ND |
| Manufacturer Part#: |
ATS-12F-11-C1-R0 |
| Price: | $ 3.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12F-11-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.06684 |
| 30 +: | $ 2.98431 |
| 50 +: | $ 2.81849 |
| 100 +: | $ 2.65268 |
| 250 +: | $ 2.48686 |
| 500 +: | $ 2.40397 |
| 1000 +: | $ 2.15528 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.77°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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。Thermal solutions are very important for electronic components and systems as they help to keep the devices and systems operating within normal and safe temperature ranges. Thermal management is especially important in military and aerospace systems, where the improved reliability, smaller size, and better performance of high-efficiency components can have a huge effect on the success of a mission or operation. An example of an item that can provide these benefits is theATS-12F-11-C1-R0 thermal heat sink.
ATS-12F-11-C1-R0 Application Field
The ATS-12F-11-C1-R0 is a natural convection heat sink designed to provide reliable cooling for electronics in extreme environments. Its base is machined from a high-grade aluminum alloy to optimize thermal performance and minimize the weight penalty from an additional thermal solution. The ATS-12F-11-C1-R0 features a fin array designed to maximize surface area and natural convection cooling. It is ideal for applications with limited airflow or where the environment is too hot or too hostile for forced convection solutions. Its use is ideal for orbital, avionics, defense, and aerospace applications requiring reliable cooling and robust performance.
ATS-12F-11-C1-R0 Working Principle
The ATS-12F-11-C1-R0 uses natural convection cooling to dissipate heat generated by electronics components. Heat is generated is conducted through the base and into the fin array, where it is then dissipated into the surrounding air by natural convection. Natural convection occurs when air is heated by the fins and starts to rise due to the density difference between the heated and unheated air. As the hot air rises, cooler air is drawn in to replace it, creating a circulating flow of air around the fins that helps to efficiently dissipate heat. Natural convection cooling solutions can provide reliable and efficient cooling with minimal added weight penalty.
Conclusion
The ATS-12F-11-C1-R0 heat sink is a reliable and efficient thermal solution designed for challenging environments and applications. Its lightweight construction and natural convection cooling capabilities make it ideal for orbital, avionics, defense, and aerospace applications where added reliability and performance is paramount. Its use of natural convection provides a reliable and efficient cooling solution without the need for additional power sources. The ATS-12F-11-C1-R0 is a great choice for anyone looking for a reliable and efficient thermal solution.
The specific data is subject to PDF, and the above content is for reference