| Allicdata Part #: | ATS21075-ND |
| Manufacturer Part#: |
ATS-12F-11-C2-R0 |
| Price: | $ 4.06 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12F-11-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.68550 |
| 10 +: | $ 3.58596 |
| 25 +: | $ 3.38663 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor in the design and development of any kind of electronics system. One of the most commonly used tools to manage the thermal load is the use of thermal heat sinks. Heat sinks are designed to dissipate heat from the electronic components to the air and keep them cool. The ATS-12F-11-C2-R0 heat sink is a popular heat sink used in a variety of applications. In this article, we\'ll discuss the different application fields and working principles of the ATS-12F-11-C2-R0.
The ATS-12F-11-C2-R0 is a flat, rectangular heat sink made of aluminum. It measures 178mm x 130mm and is just 17.8mm thick. The ATS-12F-11-C2-R0 has fins that project outward to maximize surface area and to provide extra cooling potential. The fins are designed to allow the air to freely flow through them and dissipate heat away from the components.
The ATS-12F-11-C2-R0 is designed for use in a variety of applications that require efficient thermal management. It is designed for use with integrated circuit packages such as memory and RAM. It is also commonly used in applications that require cooling components in harsh environments. It is often used in high-end computers, networking components and automotive electronics.
The working principle of the ATS-12F-11-C2-R0 is based on a simple concept known as the heat sink effect. This effect occurs when air passes over a heat sink, which causes the air to heat up and absorb heat from the components. This results in a cooling effect and prevents the components from overheating. The fins of the ATS-12F-11-C2-R0 are designed to maximize this effect by allowing more air to pass through them.
The ATS-12F-11-C2-R0 is an effective way to keep components cool and prevent them from overheating. It is designed for use in a variety of applications and can be used in harsh environments. It is a popular heat sink used in high-end electronics due to its effective thermal management capabilities. In conclusion, the ATS-12F-11-C2-R0 is a valuable tool for any system that requires efficient thermal management.
The specific data is subject to PDF, and the above content is for reference