| Allicdata Part #: | ATS-12F-116-C3-R0-ND |
| Manufacturer Part#: |
ATS-12F-116-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12F-116-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-12F-116-C3-R0 Thermal - Heat Sink is used to dissipate heat from various electrical components. This type of heat sink is commonly used in applications where very low temperature differences and high thermal conductivity are required. It is a very reliable and efficient device for cooling and dissipating heat.
The ATS-12F-116-C3-R0 Thermal - Heat Sink is commonly used in applications such as computers, gaming consoles, LED lighting, power supplies, transformers, and many other types of electronic devices. It is constructed with a base plate and fins, and is designed to dissipate heat by circulating air over the fins.
The main components of the ATS-12F-116-C3-R0 Thermal - Heat Sink are the base plate, fins, and the aluminum frame. The base plate is made of a high-quality aluminum alloy that is resistant to corrosion and oxidation. The fins are made of a high-heat conductive material, usually aluminum, and are designed to allow the air to flow smoothly over the surface. The aluminum frame is designed to hold the base plate and fins together, while allowing for easy installation and removal of the heat sink.
The ATS-12F-116-C3-R0 Thermal - Heat Sink works on a simple principle. The heat generated from the components is transferred to the fin surface where it is then dissipated by air flow. The fins create an air pocket, which increases the surface area exposed to air movement, and therefore increases the rate of heat transfer and dissipation.
The ATS-12F-116-C3-R0 Thermal - Heat Sink provides a number of advantages to its users. The fins create an air pocket to allow cooling air to flow over a greater fin surface area, and therefore decrease the temperature difference between the device and the ambient air. This leads to a reduction in power consumption of the device and an improved level of efficiency. Additionally, this device requires minimal maintenance and does not impose restrictions on the maximum allowed temperature differences in the system.
In conclusion, the ATS-12F-116-C3-R0 Thermal - Heat Sink is a reliable and efficient thermal solution for a wide range of applications. It is designed for easy installation and maintenance, and provides excellent heat dissipation. In terms of cost, this device is reasonably priced and provides excellent value for money. As such, it is an excellent choice for those who require a reliable and efficient cooling solution.
The specific data is subject to PDF, and the above content is for reference