| Allicdata Part #: | ATS-12F-15-C1-R0-ND |
| Manufacturer Part#: |
ATS-12F-15-C1-R0 |
| Price: | $ 3.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12F-15-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.49524 |
| 30 +: | $ 3.40074 |
| 50 +: | $ 3.21174 |
| 100 +: | $ 3.02280 |
| 250 +: | $ 2.83387 |
| 500 +: | $ 2.73940 |
| 1000 +: | $ 2.45602 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat SinksHeat sinks are an important application field of the ATS-12F-15-C1-R0. The main goal of a heat sink is to dissipate heat away from a component, such as a processor, that can become easily overheated and malfunction as a result. The ATS-12F-15-C1-R0 specializes in heat sinks that can be connected to a board, rather than a large, passive type. This type will fit in to a limited space and provide an effective heat transfer rate.
The ATS-12F-15-C1-R0 heat sink utilizes what is called a “word-of-mouth” design. This method optimizes the metallic surface of the heat sink to increase thermal conductivity. Protruding “fins” are also cut into the surface of the heat sink to increase its surface area. These fins disperse heat away from the processor and promote air circulation.
The ATS-12F-15-C1-R0 heat sink is connected to the processor with thermal material. This material is usually supplied in the form of a compound that is applied with a syringe. It seals the connection between the heat sink and the processor to promote a more efficient heat transfer. Once this material has been applied, the heat sink can be using a single bolt or a number of screws. This is a simple process that is easily completed by the end user.
An effective heat transfer is extremely important in the operation of processors and other components. The ATS-12F-15-C1-R0 heat sink is designed to ensure that the heat produced by the processor is dissipated quickly and efficiently, before it can do any harm. The overall design is slim and compact, yet it provides an effective and efficient heat transfer rate. With its simple installation process and proven design, the ATS-12F-15-C1-R0 heat sink can make sure that your processor runs optimally and keeps running.
The specific data is subject to PDF, and the above content is for reference